Copper foiliri kuwedzera kuwanda muChip packaging nekuda kwemagetsi ayo nemagetsi, kujairana, maitiro, uye mutengo-zvinobudirira. Here is a detailed analysis of its specific applications in chip packaging:

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• . Nekudaro, nekufambira mberi mumhangura yekugadzirisa tekinoroji uye zvinofungidzirwa nemhosva, mhangura foil uye waya yemhangura ichava zvishoma nezvishoma sarudzo. Copper yemagetsi inenge 85-95% iyo yegoridhe, asi iyo mutengo wayo inenge yegumi, ichiita kuti ive sarudzo yakakodzera yekuita uye kugona kwehupfumi.
• . Thus, using copper foil as a conductive material in bonding processes can enhance packaging efficiency and reliability without increasing costs.
• : Mufirti-chip-chip Copper foil is used to make electrodes and micro-bumps, which are directly soldered to the substrate. The low thermal resistance and high conductivity of copper ensure efficient transmission of signals and power.
• . Pamusoro pezvo, mhangura yemari yekukwira inobatsira nekukasira kupisa kupinza pane chipabasa kune iyo subsetrate kune iyo substrate kana kupisa sink, kuvandudza iyo yekukwikwidza iyo yekuwedzera manejimendi.
• : Copper foilis widely used in lead frame packaging, especially for power device packaging. Iyo inotungamira chimiro inopa rutsigiro rwechimiro uye maitiro emagetsi kune chip, chaida zvinhu zvine high's concivity uye yakanaka yekudanana. Copper foil meets these requirements, effectively reducing packaging costs while improving thermal dissipation and electrical performance.
• . These treatments further enhance the durability and reliability of copper foil in lead frame packaging.
• . Copper foil is used to manufacture internal interconnecting circuits and serve as a current conduction path. Iyi application inoda mhangura foil kuve neyakanyanya kuitirwa uye Ultra-mutete-mutete maitiro kuti uwane prealment yekuita munzvimbo diki yekuisa.
• . Maitiro ayo akaderera uye anoshamisa anozvizivisa kuti aderedze chiratidzo chinobudirira uye nekuvandudza kushanda kwekubudirira mune izvi zvizhinji-frequency.
• : In fan-out packaging, copper foil is used to construct the redistribution layer, a technology that redistributes chip I/O to a larger area. Iyo yakakwirira yekudanana uye yakanakisa denhishing foil inoita kuti ive yakanaka zvinhu zvekuvaka redistriution layers, inowedzera i / o density uye inotsigira yakawanda-chip-chip kubatanidzwa.
• : Iko kushandiswa kwemhangura foil mune dzizizi
• : Nekuda kwekunakirwa kwayo Ichi chishandiso chinonyanya kukosha mune yakakwirira-magetsi machipisi uye mapakeji anoda chaizvo kudzora tembiricha, akadai saCPU, GPUS, uye Simba Management Management.
• . Iyo yakakwirira yekuita uye yekufunga kweiyo mhangura foil inoita kuti ive yezvinhu zvaunosarudza mune izvi tekinoroji mapepa ekubatanidza, kutsigira yakakwira density yekubatanidza uye nzira pfupi chiratidzo, nekudaro inosimbisa maitiro ehurongwa.

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Zvakazara, kushandiswa kwemhangura foil muChip packaging haina kuganhurirwa kuCustomer yekuita matekiniki eClip-chip, system-packaging, uye 3D kurongedza. Zvivakwa zvezvivakwa zvezvakawanda uye kuita kwakanaka kwemhangura foil foil kunotamba basa rakakosha mukuvandudza kuvimbika, kuita, uye zvinodhura-kuita chipekupupa chip.