Zvishandiso zveCopper Foil muChip Packaging

Copper foiliri kuwedzera kukosha mukurongedza chip nekuda kweiyo magetsi conductivity, kupisa kwemhepo, kugadzirisika, uye mutengo-kushanda. Heino ongororo yakadzama yemashandisirwo ayo chaiwo mu chip packaging:

1. Copper Wire Bonding

• Kutsiviwa kweGoridhe kana Aluminium Wire: Sechinyakare, waya dzegoridhe kana aluminium dzakashandiswa mukurongedza chip kubatanidza nemagetsi chip chemukati wedunhu kune ekunze anotungamira. Nekudaro, nekufambira mberi mune tekinoroji yekugadzira mhangura uye kufunga kwemitengo, foil yemhangura uye waya yemhangura zvishoma nezvishoma zviri kuita sarudzo huru. Copper's magetsi conductivity ingangoita 85-95% iyo yegoridhe, asi mutengo wayo ungangoita chikamu chimwe mugumi, zvichiita kuti ive sarudzo yakanaka yekushanda kwepamusoro uye kubudirira kwehupfumi.
• Kuvandudza Kuita Kwemagetsi: Copper wire bonding inopa kushomeka kwakadzika uye zvirinani kupisa kwekushisa mu-high-frequency uye yakakwirira-ikozvino zvikumbiro, zvinobudirira kuderedza kurasikirwa kwesimba mukubatanidza chip uye kuvandudza kushanda kwemagetsi kwese. Nekudaro, kushandisa foil yemhangura sechinhu chinoitisa mukubatanidza maitiro kunogona kuwedzera kurongedza uye kuvimbika pasina kuwedzera mitengo.
• Inoshandiswa muElectrodes uye Micro-Bumps: Muflip-chip packaging, iyo chip inopepetwa kuitira kuti iyo yekuisa / kubuda (I / O) mapedhi ari pamusoro wayo akabatana zvakananga kudunhu pane pasuru substrate. Copper foil inoshandiswa kugadzira electrodes uye micro-bumps, iyo inotengeswa zvakananga kune substrate. Iyo yakaderera kupisa kupikisa uye yakakwirira conductivity yemhangura inovimbisa kushanda kwakanaka kwezviratidzo uye simba.
• Kuvimbika uye Thermal Management: Nekuda kwekupokana kwayo kwe electromigration uye kusimba kwemagetsi, mhangura inopa kuvimbika kwenguva refu pasi pekusiyana kwemafuta ekutenderera uye densities ikozvino. Pamusoro pezvo, mhangura yakakwira yekupisa yekupisa inobatsira kukurumidza kuburitsa kupisa kunogadzirwa panguva yechip operation kune substrate kana kupisa sink, ichiwedzera kugona kwekupisa kwepakeji.
• Tungamira Frame Material: Copper foilinoshandiswa zvakanyanya mukutungamira furemu kurongedza, kunyanya kune simba mudziyo kurongedza. Iyo inotungamira furemu inopa tsigiro yemaitiro uye magetsi ekubatanidza kune chip, ichida zvinhu zvine yakakwira conductivity uye yakanaka yekupisa conductivity. Copper foil inosangana nezvinodiwa izvi, inonyatso kudzikisa mutengo wekurongedza uku uchivandudza kupisa kwekupisa uye kushanda kwemagetsi.
• Surface Treatment Techniques: Mumashandisirwo anoshanda, foil yemhangura inowanzo rapwa pamusoro senge nickel, tin, kana sirivheri plating kudzivirira oxidation uye kunatsiridza solderability. Mishonga iyi inowedzera kusimba uye kuvimbika kwefoiri yemhangura mukurongedzerwa kwemutobvu.
• Conductive Material muMulti-Chip Modules: Sisitimu-mu-package tekinoroji inobatanidza akawanda machipisi uye maitikiro ezvikamu mupakeji imwe chete kuti iwane kubatanidzwa kwepamusoro uye kusimba kwekushanda. Copper foil inoshandiswa kugadzira mukati mekubatanidza maseketi uye inoshanda seyazvino conduction nzira. Ichi chishandiso chinoda foil yemhangura kuti ive nepamusoro conductivity uye Ultra-mutete hunhu kuti uwane yepamusoro kuita munzvimbo shoma yekurongedza.
• RF uye Millimeter-Wave Zvikumbiro: Copper foil inoitawo basa rakakosha mumaseketi ekutepfenyura masaini epamusoro-frequency muSiP, kunyanya muredhiyo frequency (RF) uye millimeter-wave application. Yayo yakaderera kurasikirwa maitiro uye yakanakisa conductivity inobvumira kuti ideredze chiratidzo attenuation zvinobudirira uye kunatsiridza kutapurirana kunyatsoshanda mune idzi dzepamusoro-frequency application.
• Inoshandiswa muRedistribution Layers (RDL): Mukuputira kwe fan-out, foil yemhangura inoshandiswa kugadzira redistribution layer, tekinoroji inogoverazve chip I/O kunzvimbo yakakura. Iyo yakakwira conductivity uye yakanaka kunamatira yemhangura foil inoita kuti ive chinhu chakanakira kuvakazve kugovera maseru, kuwedzera I / O density uye inotsigira akawanda-chip kubatanidzwa.
• Kuderedza Saizi uye Chiratidzo Kutendeseka: Kushandiswa kwefoiri yemhangura muzvikamu zvekugovera kunobatsira kuderedza saizi yepasuru uku uchivandudza kutendeseka kwechiratidzo uye nekumhanya, izvo zvinonyanya kukosha munharembozha uye yakakwirira-inoshanda komputa maapplication ayo anoda madiki epakeji hukuru uye kushanda kwepamusoro.
• Copper Foil Heat Sinks uye Thermal Channels: Nekuda kwekunaka kwayo kwekushisa kwekushisa, foil yemhangura inowanzoshandiswa mumadhishi ekupisa, nzira dzekupisa, uye zvigadziriso zvinopisa mukati me chip packaging kubatsira kukurumidza kutamisa kupisa kunogadzirwa nechip kune ekunze kutonhora zvimiro. Ichi chishandiso chakanyanya kukosha mune akakwira-simba machipisi uye mapakeji anoda chaiyo tembiricha yekudzora, senge maCPU, maGPU, uye simba manejimendi machipisi.
• Inoshandiswa muKuburikidza neSilicon Via (TSV) Technology: Mu2.5D uye 3D chip kurongedza matekinoroji, foil yemhangura inoshandiswa kugadzira conductive kuzadza zvinhu kuburikidza nesilicon vias, ichipa yakatwasuka yekubatanidza pakati pemachipi. Iyo yakakwira conductivity uye processability yemhangura foil inoita kuti ive chinhu chinofarirwa mune aya epamberi ekurongedza matekinoroji, achitsigira yakakwirira density yekubatanidza uye mapfupi masaini nzira, nekudaro ichiwedzera kuita kwese system.

2. Flip-Chip Packaging

3. Tungamira Frame Packaging

4. System-in-Package (SiP)

5. Fan-Out Packaging

6. Thermal Management uye Heat Dissipation Applications

7. Yepamberi Packaging Technologies (senge 2.5D uye 3D Packaging)

Pakazere, kushandiswa kwemhangura foil mu chip kurongedza hakungogumiri kune yechinyakare conductive yekubatanidza uye yekupisa manejimendi asi inoenderera kune ichiri kubuda yekurongedza matekinoroji akadai seflip-chip, system-in-package, fan-out packaging, uye 3D kurongedza. Iyo yakawanda inoshanda zvivakwa uye yakanakisa kuita kwemhangura foil inoita basa rakakosha mukuvandudza kuvimbika, kuita, uye kudhura-kushanda kwechip packaging.