Mashandisirwo eCopper Foil muChip Packaging

Foyi yemhanguraIri kuramba ichikosha pakurongedza machip nekuda kwekufambisa kwayo magetsi, kufambisa kwekupisa, kugona kwayo kugadzikisa zvinhu, uye kushanda kwayo zvakanaka. Heino ongororo yakadzama yekushandiswa kwayo mukupaka machip:

1. Kubatanidza Waya Yemhangura

• Kutsiva Waya yeGoridhe kana Aruminiyamu: Kare, waya dzegoridhe kana dzearuminiyamu dzave dzichishandiswa mukurongedza machip kuti dzibatanidze magetsi emukati mechip nemagetsi. Zvisinei, nekufambira mberi kwetekinoroji yekugadzira mhangura uye kufunga nezvemitengo, copper foil necopper wire zviri kuva sarudzo huru zvishoma nezvishoma. Copper's electrical conductivity inenge 85-95% kupfuura yegoridhe, asi mutengo wayo unenge chikamu chimwe mugumi, zvichiita kuti ive sarudzo yakanaka yekushanda kwepamusoro uye kushanda zvakanaka kwemari.
• Kubudirira Kwemagetsi: Kusunga waya yemhangura kunopa simba shoma uye kufambisa kwemhepo zviri nani mukushandiswa kwema "frequency" akawanda uye "high-current", zvichideredza kurasikirwa kwesimba mukubatanidza ma "chip" uye kuvandudza mashandiro emagetsi ese. Saka, kushandisa "copper foil" sechinhu chinofambisa mhepo mukubatanidza kunogona kuwedzera kushanda zvakanaka uye kuvimbika kwepakeji pasina kuwedzera mari.
• Inoshandiswa muElectrodes neMicro-Bumps: Muchipakeji cheflip-chip, chip inopindurwa kuitira kuti mapedhi ekupinda/kubuda (I/O) ari pamusoro payo abatanidzwe zvakananga kudunhu riri papakeji. Copper foil inoshandiswa kugadzira maelectrodes nema micro-bumps, ayo anosungirirwa zvakananga ku substrate. Kusapisa kwakanyanya uye conductivity yakanyanya yemhangura zvinoita kuti masaini nemagetsi zvifambiswe zvakanaka.
• Kuvimbika uye Kutarisira Kupisa: Nekuda kwekudzivirira kwayo kufambiswa kwemagetsi uye simba remakanika, mhangura inopa kuvimbika kuri nani kwenguva refu pasi pekuchinja kwekupisa uye huwandu hwemagetsi. Pamusoro pezvo, conductivity yepamusoro yemhangura inobatsira kukurumidza kubvisa kupisa kunobva panguva yekushanda kwemachipisi kuenda ku substrate kana heat sink, zvichiwedzera kugona kwayo kutonga kupisa kwepakeji.
• Zvinhu zveFremu yeLead: Foyi yemhangurainoshandiswa zvakanyanya mukurongedza furemu yemutobvu, kunyanya pakurongedza zvishandiso zvemagetsi. Furemu yemutobvu inopa rutsigiro rwechimiro uye kubatana kwemagetsi kwechip, zvichida zvinhu zvine conductivity yakakwira uye conductivity yakanaka yekupisa. Copper foil inosangana nezvinodiwa izvi, ichideredza mitengo yekurongedza zvinobudirira uku ichivandudza kupararira kwekupisa uye mashandiro emagetsi.
• Maitiro Ekurapa Pamusoro: Mukushandiswa kwazvinoitwa, jira remhangura rinowanzo gadziriswa pamusoro pechinhu chakadai senickel, tin, kana silver plating kudzivirira oxidation uye kuvandudza kusundidzirwa. Kurapa uku kunowedzera kusimba uye kuvimbika kwejira remhangura mumapuranga emutobvu.
• Zvinhu Zvinofambisa Mamodules muMulti-Chip: Tekinoroji yesystem-in-package inobatanidza machipisi akawanda nezvikamu zvisingashande mupakeji imwe chete kuti iwane kubatana kwakanyanya uye kushanda kwakanyanya. Copper foil inoshandiswa kugadzira macircuit emukati anobatanidza uye inoshanda senzira yekufambisa magetsi. Iyi application inoda copper foil kuti ive ne conductivity yakakwira uye hunhu hwakatetepa kwazvo kuti iwane kushanda kwakakwirira munzvimbo shoma yekurongedza.
• Mashandisirwo eRF neMillimeter-Wave: Foil yemhangura inoitawo basa rakakosha mukutumira masaini emagetsi ane mafrequency akakwira muSiP, kunyanya mukushandiswa kwemafrequency eredhiyo (RF) uye ma millimeter-wave. Hunhu hwayo hwekurasikirwa kushoma uye kufambisa kwakanaka kunoita kuti ideredze kudzikira kwemasaini zvinobudirira uye kunatsiridza kushanda zvakanaka kwekutumira masaini mukushandisa kwemafrequency aya ane mafrequency akakwira.
• Inoshandiswa muRedistribution Layers (RDL): Mumapakeji e fan-out, copper foil inoshandiswa kugadzira redistribution layer, tekinoroji inogovera chip I/O munzvimbo yakakura. Kufambiswa kwepamusoro uye kunamira kwakanaka kwe copper foil kunoita kuti ive chinhu chakanakira kuvaka redistribution layers, kuwedzera I/O density uye kutsigira multi-chip integration.
• Kuderedza Saizi uye Kuvimbika kweSignali: Kushandiswa kwefoil yemhangura muzvikamu zvekugovera zvakare kunobatsira kuderedza saizi yepakeji ukuwo kuchivandudza kusimba kwekutumira masaini uye kumhanya, izvo zvakakosha zvakanyanya mumidziyo yemafoni uye maapplication emakombiyuta anoshanda zvakanyanya anoda saizi diki dzekurongedza uye mashandiro epamusoro.
• Madhishi eCopper Foil Heat Sinks neThermal Channels: Nekuda kwekushanda kwayo zvakanaka kwekupisa, foil yemhangura inowanzo shandiswa muma heat sinks, ma thermal channels, uye zvinhu zve thermal interface mukati me chip packaging kuti ibatsire kukurumidza kutamisa kupisa kunobva kuchip kuenda kune ekunze cooling structures. Iyi application inonyanya kukosha muma high-power chips nema packages anoda kunyatso dzora tembiricha, akadai se CPUs, GPUs, uye power management chips.
• Inoshandiswa muThrough-Silicon Via (TSV) Technology: Mumatekinoroji e2.5D ne3D chip packaging, copper foil inoshandiswa kugadzira conductive fill material ye through-silicon vias, zvichipa vertical interconnection pakati pemachips. Kugona kupinza conductivity uye processability ye copper foil kunoita kuti ive chinhu chinodiwa mune idzi advanced packaging technologies, zvichitsigira high density integration uye shorte signal pathways, nokudaro zvichiwedzera kushanda kwesystem yese.

2. Kurongedza Chip-Chip

3. Kurongedza Musoro weChigadziko

4. Sisitimu-iri-muPakeji (SiP)

5. Kurongedza Kwefeni

6. Kutarisira Kupisa uye Kupisa Kunobvisa Matambudziko

7. Tekinoroji dzeKurongedza Dzakakwidziridzwa (dzakadai se2.5D ne3D Packaging)

Kazhinji, kushandiswa kwefoil yemhangura mukurongedza machip hakungogumiri pakubatanidza kwetsika uye manejimendi yekupisa asi kunosvika kune matekinoroji matsva ekurongedza akadai seflip-chip, system-in-package, fan-out packaging, uye 3D packaging. Hunhu hwakawanda uye kushanda kwakanaka kwefoil yemhangura zvinoita basa guru mukuvandudza kuvimbika, kushanda, uye kushanda zvakanaka kwepackaging yemachip.