Copper Foil uye Copper Strip: Ongororo Yakadzama kubva kuMagadzirirwo ekugadzira kuenda kune Mamiriro ekushandisa.

Mumunda wemhangura-based material processing, "foil yemhangura” uye “copper strip” anowanzo shandiswa mazwi ehunyanzvi.Kune vasiri nyanzvi, musiyano uripo pakati pezviviri izvi ungaita semutauro chete, asi mukugadzirwa kwemaindasitiri, musiyano uyu unobata zvakananga kusarudzwa kwezvinhu, nzira dzemagadzirirwo, uye kuita kwechigadzirwa chekupedzisira.Chinyorwa ichi chinoongorora zvine hungwaru kusiyana kwavo kwakakosha kubva pamaonero matatu akakosha: mipimo yehunyanzvi, maitiro ekugadzira, uye mashandisirwo eindasitiri.

1. Hukobvu Chiyero: Iyo Industrial Logic Kuseri kwe0.1mm Threshold

Kubva pakuona kwakakora,0.1mmndiwo mutsetse wakakosha wekupatsanura pakati pemitsetse yemhangura nemhangura foil. TheInternational Electrotechnical Commission (IEC)standard inotsanangura zvakajeka:

• Copper Strip: Inoramba ichikungurutswa mhangura zvinhu nehupamhi≥ 0.1mm
• Copper Foil: Ultra-yakaonda mhangura zvinhu zvine ukobvu<0.1mm

Uku kupatsanurwa hakusi kwekupokana asi kwakavakirwa pamaitiro ekugadzirisa zvinhu:
Kana ukobvu hunodarika0.1mm, zvinyorwa zvinowana kuenzana pakati pe ductility uye simba remagetsi, zvichiita kuti zvive zvakakodzera kushandiswa kwechipiri zvakadai sekutsika uye kupfugama. Apo ukobvu hunowira pasi0.1mm, iyo nzira yekugadzira inofanirwa kuchinjika kune chaiyo rolling, kupipamusoro kunaka uye ukobvu kufananakuva zviratidzo zvakakosha.

Mukugadzirwa kwemazuva ano kwemaindasitiri, mainstreamcopper stripzvinhu zvinowanzosiyana pakati0.15mm uye 0.2mm. Somuenzaniso, munew energy mota (NEV) mabhatiri emagetsi, 0.18mm electrolytic copper striprinoshandiswa sechinhu chakabikwa. Kuburikidza nezvinopfuura20 mapasi ekunyatso rolling, inozogadziriswa kuita ultra-thinfoil yemhangurakubva6μm kusvika 12μm, ine kushivirira ukobvu kwe±0.5μm.

2. Kurapa Kwepamusoro: Technology Differentiation Inotungamirirwa neKushanda

Mabatirwo akajairika eCopper Strip:

1. Alkaline Kuchenesa - Inobvisa masara emafuta anomonereka
2. Chromate Passivation – Mafomu a0.2-0.5μmkudzivirira layer
3. Kuomesa uye Kuumba

Kuwedzerwa Kurapa kweCopper Foil:

Mukuwedzera kune maitiro emhangura yemhangura, foil yemhangura inopinda:

1. Electrolytic Degreasing - Zvishandiso3-5A/dm² ikozvino densitypa50-60°C
2. Nano-Level Surface Roughening - Inodzora kukosha kweRa pakati0.3-0.8μm
3. Anti-Oxidation Silane Kurapa

Aya mamwe maitiro anoenderanaspecialized end-use zvinodiwa:
In Yakadhindwa Circuit Board (PCB) kugadzira, foil yemhangura inofanira kuumba amolecular-level bondine resin substrates. Kunyangemicron-level oiri yakasarazvinogona kukonzeradelamination defects. Dhata kubva kune inotungamira PCB inogadzira inoratidza izvozvoelectrolytic degreased copper foilinovandudzasvuura simba ne27%uye inoderedzadielectric kurasikirwa ne15%.

3. Indasitiri Positioning: Kubva Raw Material kusvika Functional Material

Copper stripanoshanda sa"Basic Material Supplier"mumaketani ekugovera, anonyanya kushandiswa mu:

• Power Equipment: Transformer windings (0.2-0.3mm gobvu)
• Industrial Connectors: Terminal conductive mapepa (0.15-0.25mm gobvu)
• Architectural Applications: Denga rekudzivirira mvura (0.3-0.5mm gobvu)

Kusiyana neizvi, foil yemhangura yakashanduka kuita a“functional material”iyo isingatsivike mu:

Kutoramabhatiri emagetsisemuenzaniso, foil yemhangura inoverengera10-15%yemutengo wemidziyo yesero. Every1μm kuderedzamukukora kunowedzerabhatiri simba density ne 0.5%. Ichi ndicho chikonzero vatungamiriri veindasitiri vanofariraCATLvari kusunda copper foil ukobvu kuti4μm.

4. Technological Evolution: Kubatanidza Miganhu uye Kubudirira Kwekushanda

Nekufambira mberi kwesainzi yezvinhu, muganho wechinyakare pakati pefoiri yemhangura nemhangura mitsetse iri kushanduka zvishoma nezvishoma:

1. Ultra-Mutete Copper Strip: 0.08mm "quasi-foil" zvigadzirwazvino kushandiswaelectromagnetic kudzivirira.
2. Composite Copper Foil: 4.5μm mhangura + 8μm polymer substrateinoumba "sandwich" chimiro chinotyora miganhu yemuviri.
3. Functionalized Copper Strip: Mitsara yemhangura yakavharwa nekabhoni iri kuvhurwamiganhu mitsva mumafuta cell bipolar plates.

Aya matsva anodazviyero zvepamusoro zvekugadzira. Maererano nemugadziri mukuru wemhangura, achishandisamagnetron sputtering tekinorojinekuti machira emhangura anosanganiswa adzikiswaunit-area resistance by 40%uye kuvandudzwakukotama kuneta hupenyu ne3 nguva.

Mhedziso: Ukoshi Uri Seri Kwemukana Wezivo

Kunzwisisa musiyano uripocopper stripuyefoil yemhangurairi pamusoro pekubata"quantitative to qualitative"kuchinja kwezvinhu engineering. Kubva ku0.1mm ukobvu chikumbaridzokumicron-level surface treatmentsuyenanometer-scale interface control, kubudirira kwega kwega kwetekinoroji kuri kugadzirisa mamiriro eindasitiri.

Munguva yekusarerekera kabhoni, ruzivo urwu ruchapesvedzera zvakanangakukwikwidza kwekambanimuchikamu chitsva chemidziyo. Mushure mezvose, muneindasitiri yebhatiri remagetsi, a0.1mm gap mukunzwisisazvinogona kureva anchizvarwa chose chemusiyano wetekinoroji.