Tin plating inopa "solid metallic armor" yefoil yemhangura, ichirova chiyero chakakwana pakati pekutengesa, kusaita ngura, uye mutengo wakanaka. Ichi chinyorwa chinopaza kuti tin-plated copper foil yave chinhu chepakati chevatengi uye mota dzemagetsi. Iyo inotaridza yakakosha maatomu ekubatanidza masisitimu, maitiro ekuvandudza, uye ekupedzisira-mashandisirwo ekushandisa, uchiongorora.CIVEN METALkufambira mberi mune tekinoroji yeplating.
1. Mabhenefiti Matatu Akakosha eTin Plating
1.1 A Quantum Leap muSoldering Performance
A tin layer (yakapoteredza 2.0μm gobvu) inoshandura soldering nenzira dzakawanda:
- Low-Temperature Soldering: Tini inonyunguduka pa231.9°C, ichideredza tembiricha yekunyungudusa kubva pa850°C mhangura kusvika pa250–300°C chete.
- Kuvandudzwa kweWetting: Tin's surface tension inodonha kubva pamhangura 1.3N/m kusvika 0.5N/m, ichiwedzera nzvimbo yekuparadzira solder ne80%.
- Yakagadziridzwa IMCs (Intermetallic Compounds): A Cu₆Sn₅/Cu₃Sn gradient layer inowedzera simba rekugera kusvika ku45MPa (isina mhangura solder inowana chete 28MPa).
1.2 Corrosion Resistance: "Dynamic Barrier"
| Corrosion Scenario | Bare Copper Kukundikana Nguva | Tin-Plated Copper Kukundikana Nguva | Protection Factor |
| Industrial Atmosphere | 6 months (green rust) | 5 makore (kurasikirwa uremu <2%) | 10x |
| Sweat Corrosion (pH=5) | Maawa makumi manomwe nemaviri (perforation) | 1,500 maawa (hapana kukanganisa) | 20x |
| Hydrogen sulfide Corrosion | Maawa makumi mana nemasere (yakasviba) | 800 maawa (hapana discoloration) | 16x |
1.3 Kuitisa: A “Micro-Sacrifice” Strategy
- Kuramba kwemagetsi kunowedzera zvishoma, ne12% (1.72×10⁻⁸ kusvika 1.93×10⁻⁸ Ω·m).
- Ganda maitiro anovandudza: Pa10GHz, kudzika kweganda kunowedzera kubva pa0.66μm kusvika 0.72μm, zvichikonzera kurasikirwa kwekuisa kukwira kwe 0.02dB/cm chete.
2. Gadzirisa Zvinetso: "Kucheka vs. Plating"
2.1 Kuputira Kwakazara (Kucheka Usati Waputirwa)
-Zvakanakira: Mipendero yakafukidzwa zvizere, isina mhangura yakafumurwa.
- Zvinetso zveTechnical:
- Burrs inofanira kudzorwa pazasi 5μm (maitiro echinyakare anopfuura 15μm).
-Plating solution inofanira kupinda kupfuura 50μm kuti ive nechokwadi chekuvharidzirwa kweyunifomu.
2.2 Post-Cheka Plating (Plaing Usati Wachekwa)
- Mutengo Benefits: Inowedzera kugadzirisa kushanda ne30%.
- Matambudziko Anokosha:
- Mipendero yemhangura yakaburitswa inotangira pa100–200μm.
- Upenyu hwekupfapfaidza munyu hunoderedzwa ne40% (kubva pamaawa e2,000 kusvika kumaawa 1,200).
2.3CIVEN METAL's "Zero-Defect" Nzira
Kubatanidza laser chaiyo yekucheka nepulse tin plating:
- Kucheka Kwakarurama: Mabhura anochengetwa pasi pe2μm (Ra = 0.1μm).
- Edge Coverage: Side plating ukobvu ≥0.3μm.
- Mutengo-Kubudirira: Inodhura 18% yakaderera pane yechinyakare yakazara yakazara nzira dzekuisa.
3. CIVEN METALTin-PlatedCopper Foil: Muchato weSainzi uye Aesthetics
3.1 Kudzora Kwazvo kweCoating Morphology
| Type | Process Parameters | Key Features |
| Bright Tin | Yazvino density: 2A/dm², additive A-2036 | Reflectivity >85%, Ra=0.05μm |
| Matte Tin | Yazvino density: 0.8A/dm², hapana zvekuwedzera | Reflectivity <30%, Ra=0.8μm |
3.2 Superior Performance Metrics
| Metric | Indasitiri Avhareji |CIVEN METALTin-Plated Copper | Kuvandudza |
| Coating Thickness Deviation (%) | ±20 | ±5 | -75% |
| Solder Void Rate (%) | 8–12 | ≤3 | -67% |
| Bend Resistance (macycles) | 500 (R=1mm) | 1,500 | +200% |
| Tin Whisker Kukura (μm/1,000h) | 10–15 | ≤2 | -80% |
3.3 Nzvimbo Dzakakosha Yekushandisa
- Smartphone FPCs: Matte tin (ukobvu 0.8μm) inovimbisa yakagadzikana soldering ye 30μm mutsara / spacing.
- ECUs dzemotokari: Bright tin inomira 3,000 thermal cycles (-40 ° C↔ + 125 ° C) pasina solder joint kukundikana.
- Photovoltaic Junction Mabhokisi: Kaviri-sided tin plating (1.2μm) inowana kupikisa kuramba <0.5mΩ, inowedzera kushanda zvakanaka ne0.3%.
4. Ramangwana Remarata Plating
4.1 Nano-Composite Coatings
Kugadzira Sn-Bi-Ag ternary alloy coatings:
- Yakaderera kunyungudika kusvika 138 ° C (yakanakira yakaderera-tembiricha inoshanduka magetsi).
- Inovandudza creep resistance ne3x (kupfuura 10,000 maawa pa125 ° C).
4.2 Green Tin Plating Revolution
- Cyanide-Yemahara Solutions: Inoderedza tsvina yeCOD kubva pa5,000mg/L kusvika 50mg/L.
- High Tin Recovery Rate: Kupfuura 99.9%, kucheka maitiro kunodhura ne25%.
Tin plating inoshandurafoil yemhangurakubva kune yakakosha conductor kuenda kune "intelligent interface material."CIVEN METAL's atomic-level process control inosundidzira kuvimbika uye kusimba kwezvakatipoteredza kwetin-plated copper foil kune hurefu hutsva. Sezvo zvemagetsi zvevatengi zvinoderera uye zvemagetsi zvemotokari zvinoda kuvimbika kwakanyanya,tin-plated mhangura foiliri kuve musimboti wekuchinja kwekubatanidza.
Nguva yekutumira: May-14-2025