Passivation inzira yakakosha mukugadzirwa kwe rolledfoil yemhangura. Inoshanda se "molecular-level shield" pamusoro, inosimudzira kusadzivirirwa kwecorrosion uku ichinyatso kuenzanisa maitiro ayo pazvinhu zvakakosha se conductivity uye solderability. Ichi chinyorwa chinotarisa mune sainzi kuseri kwemaitiro ekufambisa, kutengeserana kwekuita, uye maitiro einjiniya. KushandisaCIVEN METAL's kubudirira semuenzaniso, tichaongorora kukosha kwayo kwakasiyana mukugadzirwa kwemagetsi ekupedzisira.
1. Passivation: A "Molecular-Level Shield" yeCopper Foil
1.1 Maitiro eiyo Passivation Layer Mafomu
Kuburikidza nemakemikari kana electrochemical kurapwa, compact oxide layer 10-50nm gobvu mafomu pamusoro peiyo.foil yemhangura. Yakagadzirwa zvakanyanya neCu₂O, CuO, uye organic complexes, iyi layer inopa:
- Zvipingamupinyi Pamuviri:Iyo oxygen diffusion coefficient inodzikira kusvika 1×10⁻¹⁴ cm²/s (pasi kubva pa5×10⁻⁸ cm²/s yemhangura isina chinhu).
- Electrochemical Passivation:Corrosion current density inodonha kubva pa10μA/cm² kusvika pa0.1μA/cm².
- Kemikari Inertness:Simba remahara repamusoro rakaderedzwa kubva pa72mJ/m² kusvika pa35mJ/m², kudzvanyirira maitiro ekuita.
1.2 Mabhenefiti Mashanu Akakosha ePasivation
| Performance Aspect | Isina Kugadziriswa Copper Foil | Passivated Copper Foil | Kuvandudza |
| Salt Spray Test (maawa) | 24 (inooneka ngura mavara) | 500 (hapana ngura inooneka) | + 1983% |
| High-Temperature Oxidation (150°C) | 2 maawa (inoshanduka kuva nhema) | Maawa 48 (inochengetedza ruvara) | + 2300% |
| Kuchengetedza Hupenyu | 3 mwedzi (vacuum-yakazara) | Mwedzi 18 (yakajairwa yakazara) | +500% |
| Contact Resistance (mΩ) | 0.25 | 0.26 (+4%) | - |
| Yakakwira-Frequency Insertion Loss (10GHz) | 0.15dB/cm | 0.16dB/cm (+6.7%) | - |
2. “Munondo Unocheka Kaviri” wePasivation Layers—uye Maitiro Okuenzanisa
2.1 Kuongorora Njodzi
- Kuderera Kuduku muKubata:Iyo passivation layer inowedzera kudzika kweganda (pa10GHz) kubva 0.66μm kusvika 0.72μm, asi nekuchengetedza ukobvu pasi pe30nm, resistivity inowedzera inogona kugumira pasi pe5%.
- Soldering Matambudziko:Simba repasi repasi rinowedzera solder wetting angles kubva pa15° kusvika 25°. Kushandisa inoshanda solder pastes (RA type) inogona kudzima mhedzisiro iyi.
- Adhesion Matambudziko:Resin bonding simba inogona kudonha 10-15%, iyo inogona kudzikiswa nekubatanidza roughening uye passivation maitiro.
2.2CIVEN METAL's Bancing Approach
Gradient Passivation Technology:
- Base Layer:Electrochemical growth of 5nm Cu₂O ine (111) inodiwa yekutarisa.
- Pakati Pepakati:Imwe 2-3nm benzotriazole (BTA) yakazviunganidza firimu.
- Outer Layer:Silane coupling agent (APTES) kuwedzera resin adhesion.
Optimized Performance Results:
| Metric | IPC-4562 Zvinodiwa | CIVEN METALCopper Foil Results |
| Kuramba Kwepamusoro (mΩ/sq) | ≤300 | 220–250 |
| Simba rePeel (N/cm) | ≥0.8 | 1.2–1.5 |
| Solder Joint Tensile Simba (MPa) | ≥25 | 28–32 |
| Ionic Migration Rate (μg/cm²) | ≤0.5 | 0.2–0.3 |
3. CIVEN METAL's Passivation Tekinoroji: Kutsanangudza Dziviriro Maitiro
3.1 A Four-Tier Dziviriro System
- Ultra-Thin Oxide Control:Pulse anodization inowana ukobvu kusiyana mukati me ± 2nm.
- Organic-Inorganic Hybrid Layers:BTA uye silane zvinoshanda pamwechete kuderedza ngura kusvika 0.003mm/gore.
- Surface Activation Treatment:Plasma yekuchenesa (Ar/O₂ gasi musanganiswa) inodzoreredza solder wetting angles kusvika 18°.
- Real-Time Monitoring:Ellipsometry inovimbisa passivation layer ukobvu mukati me ± 0.5nm.
3.2 Yakanyanya Kusimbiswa Kwenzvimbo
- High Humidity uye Kupisa:Mushure memaawa e1,000 pa85 ° C / 85% RH, kumira kwepamusoro kunoshanduka nepasi pe3%.
- Thermal Shock:Mushure me 200 cycles ye -55 ° C kusvika + 125 ° C, hapana kuputika kunowanikwa mupassivation layer (yakasimbiswa neSEM).
- Chemical Resistance:Kupokana ne10% HCl mhute inowedzera kubva pamaminitsi mashanu kusvika pamaminitsi makumi matatu.
3.3 Kuenderana Pakati Pemaapplication
- 5G Millimeter-Wave Antennas:28GHz yekuisa kurasikirwa yakaderedzwa kusvika chete 0.17dB/cm (ichienzaniswa nevakwikwidzi '0.21dB/cm).
- Zvemagetsi zvemotokari:Inopasa ISO 16750-4 munyu yekupfapfaidza bvunzo, ine yakawedzera kutenderera kusvika ku100.
- IC Substrates:Simba rekunamatira neABF resin rinosvika 1.8N / cm (industry average: 1.2N/cm).
4. Ramangwana rePasivation Technology
4.1 Atomic Layer Deposition (ALD) Technology
Kugadzira nanolaminate passivation mafirimu akavakirwa paAl₂O₃/TiO₂:
- Ukobvu:<5nm, ine resistivity inowedzera ≤1%.
- CAF (Conductive Anodic Filament) Kuramba:5x kuvandudzika.
4.2 Self-Healing Passivation Layers
Kusanganisira microcapsule corrosion inhibitors (benzimidazole derivatives):
- Kuzviporesa Kubudirira:Kupfuura 90% mukati maawa makumi maviri nemana mushure mekukwenya.
- Hupenyu hweSevhisi:Yakawedzerwa kusvika kumakore makumi maviri (kuenzaniswa neyakajairwa 10-15 makore).
Mhedziso:
Passivation kurapwa inowana yakanatswa chiyero pakati pedziviriro uye kushanda kweakakungurutswafoil yemhangura. Kuburikidza nekuvandudza,CIVEN METALinoderedza kudzika kwepasi, ichichishandura kuita "chisikwa chisingaoneki chezvombo" chinowedzera kuvimbika kwechigadzirwa. Sezvo indasitiri yemagetsi ichienda kune yakakwira density uye kuvimbika, chaiyo uye inodzorwa passivation yave musimboti wekugadzira foil yemhangura.
Nguva yekutumira: Mar-03-2025