Mumunda wefoil yemhangurakugadzira, roughening post-kurapwa ndiyo kiyi nzira yekuvhura iyo yezvinhu interface bonding simba. Ichi chinyorwa chinoongorora kukosha kwekuomesera kurapwa kubva pamaonero matatu: mechanical anchoring effect, maitiro ekuita nzira, uye kupera-kushandiswa kuchinjika. Inotarisawo kukosha kwekushandiswa kweiyi tekinoroji muminda senge 5G kutaurirana uye nyowani simba mabhatiri, zvichibva paCIVEN METAL's technical pundutso.
1. Roughening Treatment: Kubva “Smooth Trap” kuenda ku “Anchored Interface”
1.1 Izvo Zvinouraya Zvikanganiso zveSmooth Surface
Iyo yepakutanga roughness (Ra) yefoil yemhanguranzvimbo dzinowanzoita isingasviki 0.3μm, izvo zvinotungamira kune zvinotevera nyaya nekuda kweiyo girazi-senge maitiro:
- Insufficient Physical Bonding: Nzvimbo yekusangana ine resin inongova 60-70% yeiyo theoretical kukosha.
- Chemical Bonding Barriers: A dense oxide layer (Cu₂O ukobvu anenge 3-5nm) inotadzisa kuratidzwa kwemapoka anoshanda.
- Thermal Stress Sensitivity: Kusiyana muCTE (Coefficient of Thermal Expansion) inogona kukonzera interface delamination (ΔCTE = 12ppm / ° C).
1.2 Mabhindauko Matatu Makiyi eTekinoroji muRoughening Maitiro
| Process Parameter | Traditional Copper Foil | Roughened Copper Foil | Kuvandudza |
| Kukasharara Kwepamusoro Ra (μm) | 0.1-0.3 | 0.8-2.0 | 700-900% |
| Nzvimbo Yakasarudzika (m²/g) | 0.05-0.08 | 0.15-0.25 | 200-300% |
| Simba rePeel (N/cm) | 0.5-0.7 | 1.2-1.8 | 140-257% |
Nekugadzira micron-level matatu-dimensional chimiro (ona Mufananidzo 1), iyo yakaomeswa layer inowana:
- Mechanical Interlocking: Resin kupinda mafomu "barbed" anchoring (kudzika> 5μm).
- Chemical Activation: Kufumura (111) yakakwirira-chiitiko chekristaro ndege dzinowedzera bonding saiti density kune 10⁵ masaiti/μm².
- Thermal Stress Buffering: Iyo porous chimiro inotora pamusoro pe60% yekupisa kunetseka.
- Process Route: Acidic copper plating solution (CuSO₄ 80g/L, H₂SO₄ 100g/L) + Pulse Electro-deposition (duty cycle 30%, frequency 100Hz)
- Mamiriro ezvinhu:
- Copper dendrite kureba 1.2-1.8μm, dhayamita 0.5-1.2μm.
- Pamusoro peokisijeni yemukati ≤200ppm (XPS kuongororwa).
- Bata kuramba <0.8mΩ·cm².
- Process Route: Cobalt-nickel alloy plating solution (Co²+ 15g/L, Ni²+ 10g/L) + Chemical Displacement Reaction (pH 2.5-3.0)
- Mamiriro ezvinhu:
- CoNi alloy particle size 0.3-0.8μm, stacking density > 8×10⁴ zvidimbu/mm².
- Pamusoro peokisijeni yemukati ≤150ppm.
- Bata kuramba <0.5mΩ·cm².
2. Red Oxidation vs. Black Oxidation: The Process Secrets Kuseri Kwemavara
2.1 Tsvuku Oxidation: Copper's "Zvombo"
2.2 Nhema Oxidation: Iyo Alloy "Zvombo"
2.3 Commercial Logic Kuseri Kwekusarudzwa Kwemavara
Kunyangwe iwo akakosha maratidziro ekuita (adhesion uye conductivity) yered uye dema oxidation inosiyana neisingasviki 10%, musika unoratidza mutsauko wakajeka:
- Tsvuku Oxidized Copper Foil: Maakaundi e60% yemugove wemusika nekuda kwekukosha kwayo kwemutengo (12 CNY/m² vs. dema 18 CNY/m²).
- Black Oxidized Copper Foil: Inotonga musika wepamusoro-soro (mota-yakaiswa FPC, millimeter-wave PCBs) ine 75% musika wemugove nekuda kwe:
- 15% kuderedzwa kwepamusoro-frequency kurasikirwa (Df = 0.008 vs. red oxidation 0.0095 pa10GHz).
- 30% yakavandudza CAF (Conductive Anodic Filament) kuramba.
3. CIVEN METAL: "Nano-Level Masters" yeRoughening Technology
3.1 Inovandudza "Gradient Roughening" Tekinoroji
Kuburikidza nematanho matatu-maitiro ekudzora,CIVEN METALinogonesa chimiro chepamusoro (ona Mufananidzo 2):
- Nano-Crystalline Mbeu Layer: Electro-deposition yemhangura cores 5-10nm muhukuru, density> 1×10¹¹ zvimedu/cm².
- Micron Dendrite Kukura: Pulse ikozvino inodzora dendrite orientation (inotungamira iyo (110) kutungamira).
- Surface Passivation: Organic silane coupling agent (APTES) coating inovandudza oxidation kuramba.
3.2 Kuita Kupfuura Mitemo Yeindasitiri
| Test Item | IPC-4562 Standard | CIVEN METALMeasured Data | Advantage |
| Simba rePeel (N/cm) | ≥0.8 | 1.5-1.8 | + 87-125% |
| Surface Roughness CV Kukosha | ≤15% | ≤8% | -47% |
| Kurasika kwehupfu (mg/m²) | ≤0.5 | ≤0.1 | -80% |
| Humidity Resistance (h) | 96 (85°C/85%RH) | 240 | +150% |
3.3 Kupedzisa-Shandisa Zvishandiso Matrix
- 5G Base Station PCB: Inoshandisa dema oxidized copper foil (Ra = 1.5μm) kuwana <0.15dB/cm kuisa kurasikirwa pa28GHz.
- Simba Battery Collectors: Red oxidizedfoil yemhangura(tensile simba 380MPa) inopa hupenyu hwekutenderera> 2000 mitsetse (yenyika chiyero 1500 cycles).
- Aerospace FPCs: The roughened layer inomira ne thermal shock kubva -196°C kusvika +200°C for 100 cycles pasina delamination.
4. The Ramangwana Battlefield for Roughened Copper Foil
4.1 Ultra-Roughening Technology
Kune 6G terahertz kutaurirana zvinoda, chimiro che serrated chine Ra = 3-5μm chiri kuvandudzwa:
- Dielectric Constant Stability: Yakavandudzwa kusvika ΔDk <0.01 (1-100GHz).
- Thermal Resistance: Yakaderedzwa ne40% (kuwana 15W/m·K).
4.2 Smart Roughening Systems
Yakabatanidzwa AI yekuona yekuona + inochinja maitiro kugadzirisa:
- Real-Nguva Surface Monitoring: Sampling frequency 100 mafuremu pasekondi.
- Adaptive Current Density AdjustmentKunyatso ±0.5A/dm².
Copper foil roughening mushure mekurapwa yakabva ku "optional process" kuenda kune "performance multiplier." Kuburikidza neiyo process innovation uye yakanyanya kunaka kutonga,CIVEN METALyakasundira roughening tekinoroji kune atomic-level chaiyo, ichipa hwaro hwezvinhu rutsigiro rwekusimudzira indasitiri yemagetsi. Mune ramangwana, munhangemutange yehungwaru, yakakwira frequency, uye yakavimbika matekinoroji, ani nani anokunda iyo "micro-level kodhi" yeiyo roughening tekinoroji ichatonga yakasarudzika nzvimbo yepasi.foil yemhanguraindustry.
(Data Source:CIVEN METAL2023 Yegore Tekinoroji Report, IPC-4562A-2020, IEC 61249-2-21)
Nguva yekutumira: Kubvumbi-01-2025