Electrodeposited (ED)foil yemhangurandiyo isingaoneki musana wemagetsi emazuva ano. Yayo yekupedzisira-yakaonda mbiri, yakakwirira ductility, uye yakanakisa conductivity inoita kuti ive yakakosha mumabhatiri e lithium, PCBs, uye flexible electronics. Kusiyanayakakungurutswa yemhangura foil, iyo inovimba ne mechanical deformation,ED copper foilinogadzirwa ne electrochemical deposition, kuwana atomic-level control uye maitiro ekuita. Ichi chinyorwa chinoburitsa iyo chaiyo kuseri kwekugadzirwa kwayo uye kuti maitiro matsva ari kushandura sei maindasitiri.
I. Yakagadzirirwa Kugadzirwa: Kururamisa muElectrochemical Engineering
1. Electrolyte Kugadzirira: A Nano-Optimized Formula
Iyo base electrolyte ine yakakwira-kuchena mhangura sulfate (80-120g/L Cu²⁺) uye sulfuric acid (80-150g/L H₂SO₄), ine gelatin uye thiourea yakawedzerwa pamazinga eppm. Masisitimu epamusoro eDCS anogadzirisa tembiricha (45–55°C), mwero wekuyerera (10–15 m³/h), uye pH (0.8–1.5) nemazvo. Additives adsorb kune cathode kutungamira nano-level zviyo kuumbwa uye inhibit kukanganisa.
2. Foil Deposition: Atomic Precision in Action
Mumasero e electrolytic ane titanium cathode rolls (Ra ≤ 0.1μm) uye lead alloy anodes, 3000–5000 A/m² DC ikozvino inodhiraivha ion yemhangura panzvimbo yecathode mu (220) yakatarisa. Foil ukobvu (6-70μm) yakanyatso kurongedzerwa kuburikidza nekumhanyisa kumhanya (5-20 m/min) uye zvigadziriso zvazvino, kuwana ± 3% ukobvu kutonga. The thinnest foil inogona kusvika 4μm—1/20th ukobvu hwebvudzi remunhu.
3. Washing: Ultra-Clean Surfaces ine Mvura Yakachena
A matatu-stage reverse rinsing system inobvisa zvese zvakasara: Danho rekutanga rinoshandisa mvura yakachena (≤5μS/cm), Danho rechipiri rinoshandisa ultrasonic masaisai (40kHz) kubvisa organic traces, uye Danho re3 rinoshandisa mhepo inopisa (80-100 ° C) yekuomesa isina mavara. Izvi zvinogumafoil yemhanguranemazinga eokisijeni <100ppm uye sarufa zvakasara <0.5μg/cm².
4. Slitting uye Packaging: Precision kune Final Micron
Michina yekumhanyisa-yekutsemura ine laser edge control inovimbisa kushivirira kwehupamhi mukati me ± 0.05mm. Vacuum anti-oxidation packaging ine humidity zviratidzo inochengetedza kunaka kwepamusoro panguva yekufambisa uye kuchengetedza.
II. Surface Treatment Customization: Kuvhura Indasitiri-Yakananga Kuita
1. Roughening Treatments: Micro-Anchoring for Enhanced Bonding
Nodule Treatment:Pulse plating muCuSO₄-H₂SO₄-As₂O₃ mhinduro inogadzira 2-5μm nodules pamusoro pefoil surface, inovandudza adhesion simba kusvika 1.8-2.5N/mm-yakanakira 5G circuit board.
Dual-Peak Roughening:Micro- uye nano-scale copper particles inowedzera pamusoro penzvimbo ne300%, inovandudza slurry adhesion mu lithium battery anodes ne 40%.
2. Functional Plating: Molecular-Scale Armor for Durability
Zinc/Tin Plating:A 0.1–0.3μm simbi layer inowedzera munyu kupfapfaidza kuramba kubva pa4 kusvika kumaawa 240, zvichiita kuti ive yekuenda kune EV bhatiri tebhu.
Nickel-Cobalt Alloy Coating:Pulse-plated nano-grain layers (≤50nm) inowana kuoma kweHV350, inotsigira ma substrates anogona kubhenda emafoni anopeta.
3. High-Temperature Resistance: Kupona Zvakanyanya
Sol-gel SiO₂-Al₂O₃ coatings (100-200nm) inobatsira foil kurwisa oxidation pa400 ° C (oxidation <1mg/cm²), ichiita kuti ienderane neaerospace wiring system.
III. Kugonesa Matatu Makuru Maindasitiri Frontiers
1. New Energy Batteries
CIVEN METAL's 3.5μm foil (≥200MPa tensile, ≥3% elongation) inowedzera 18650 bhatiri simba density ne15%. Tsika perforated foil (30-50% porosity) inobatsira kudzivirira lithium dendrite kuumbwa mumabhatiri akasimba-nyika.
2. Advanced PCBs
Low-profile (LP) foil neRz ≤1.5μm inoderedza kurasikirwa kwechiratidzo mu5G millimeter-wave board ne20%. Ultra-low profile (VLP) foil ine reverse-treated finish (RTF) inotsigira data rates ye100Gb/s.
3. Flexible Electronics
AnnealedED copper foil(≥20% elongation) yakashongedzwa nemafirimu ePI inomira pamusoro pe200,000 bend (1mm radius), ichiita se "skeleton inochinjika" yezvipfeko.
IV. CIVEN METAL: The Customization Mutungamiriri muED Copper Foil
Sesimba rakanyarara muED copper foil,CIVEN METALyakavaka agile, modular kugadzira system:
Nano-Additive Library:Kupfuura mazana maviri ekuwedzera musanganiswa akagadzirirwa yakakwira tensile simba, kureba, uye kugadzikana kwekupisa.
AI-inotungamirwa Foil Kugadzira:AI-yakagadziridzwa paramita inovimbisa ± 1.5% ukobvu kurongeka uye ≤2I flatness.
Surface Treatment Hub:12 mitsetse yakatsaurirwa inopa makumi maviri+ zvinogoneka sarudzo (roughening, plating, coatings).
Mutengo Innovation:In-line kudzoreredza tsvina kunowedzera kushandiswa kwemhangura yakasvibirira kusvika 99.8%, ichidzikisa mutengo wefoil ne10-15% pazasi peavhareji yemusika.
Kubva paatomic lattice control kusvika kune macro-scale performance tuning,ED copper foilinomiririra nguva itsva yeinjiniya yezvinhu. Sezvo shanduko yepasi rose yakananga kugetsi uye smart zvishandiso zvinokurumidza,CIVEN METALinotungamira kuchaji ne "atomic precision + application innovation" modhi-inosundidzira kugadzirwa kwepamusoro kweChina kusvika pamusoro pecheni yepasi rose.
Nguva yekutumira: Jun-03-2025