Indasitiri yePCB yemidziyo yakashandisa nguva yakakura yekugadzira zvinhu zvinopa kurasikirwa kwechiratidzo chakaderera. Zvekumhanya zvakanyanya uye yakakwirira frequency dhizaini, kurasikirwa kunodzikamisa chiratidzo chekuparadzira chinhambwe uye kukanganisa masiginecha, uye zvinogadzira kutsauka kweiyo impedance iyo inogona kuoneka muTDR zviyero. Sezvo isu tichigadzira chero akadhindwa redunhu bhodhi uye nekugadzira maseketi anoshanda nepamusoro mafrequency, zvingave zvinoyedza kusarudza iyo inotsvedzerera inogoneka mhangura mumagadzirirwo ese aunogadzira.

Kunyange chiri chokwadi kuti kushata kwemhangura kunogadzira imwe impedance kutsauka uye kurasikirwa, iyo foil yako yemhangura inofanirwa kuve yakatsetseka sei? Pane dzimwe nzira dzakareruka dzaungashandisa kukunda kurasikirwa pasina kusarudza ultra-smooth copper kune yega yega dhizaini? Tichatarisa mapoinzi aya muchinyorwa chino, pamwe nezvaungatsvaga kana ukatanga kutenga PCB stackup zvinhu.

Mhando dzePCB Copper Foil

Kazhinji kana tichitaura nezvemhangura paPCB zvinhu, hatitauri nezvemhando chaiyo yemhangura, isu tinongotaura nezve roughness yayo. Nzira dzakasiyana dzekuisa mhangura dzinoburitsa mafirimu ane hukasha hwakasiyana, hunogona kunyatsosiyaniswa mumufananidzo we scanning electron maikorosikopu (SEM). Kana iwe uchange uchishanda pakakwirira (kazhinji 5 GHz WiFi kana pamusoro) kana nekumhanya kwakanyanya, saka teerera kune mhando yemhangura yakatsanangurwa mune yako zvinyorwa.

Zvakare, ita shuwa kuti unonzwisisa zvinorehwa neDk kukosha mudhetabheti. Tarisa iyi podcast nhaurirano naJohn Coonrod kubva kuRogers kuti udzidze zvakawanda nezve Dk zvakatemwa. Tine izvozvo mupfungwa, ngatitarisei mamwe emhando dzakasiyana dzePCB copper foil.

Electrodeposited

Mukuita uku, dhiramu rinorukwa kuburikidza nemushonga we electrolytic, uye electrodeposition reaction inoshandiswa "kukura" foil yemhangura padhiramu. Sezvo ngoma inotenderera, firimu remhangura rinobuda rinoputirwa zvishoma nezvishoma pamurora, richipa pepa rinoramba riripo remhangura iro rinogona kuzokungurutswa palaminate. Rutivi rwedhiramu rendarira rinonyatsoenderana nekukasharara kwedhiramu, ukuwo divi rakashama rinenge ranyanya kushata.

Electrodeposited PCB copper foil

Electrodeposited mhangura kugadzirwa.
Kuti ishandiswe mune yakajairwa PCB yekugadzira maitiro, iyo yakakasharara yemhangura inotanga kusungirirwa kune girazi-resin dielectric. Iyo yasara yakafumurwa mhangura (dhiramu divi) inozoda kuomeswa nemaune kemikari (semuenzaniso, neplasma etching) isati yashandiswa mune yakajairwa copper clad lamination process. Izvi zvinovimbisa kuti inogona kusungirirwa kune inotevera layer muPCB stackup.

Surface-Treated Electrodeposited Copper

Ini handizive izwi rakanakisa rinobatanidza ese akasiyana marudzi ekurapwa pamusoromapepa emhangura, saka musoro uri pamusoro apa. Izvi zvinhu zvemhangura zvinonyanya kuzivikanwa sereverse kurapwa foils, kunyangwe mamwe maviri akasiyana aripo (ona pazasi).

Reverse yakarapwa mafoil shandisa mushonga wepamusoro unoshandiswa kudivi rakatsetseka (drum side) ye electrodeposited copper sheet. Chigadziro chekurapa chingori chifukidziro chakatetepa chinoomesa nemaune mhangura, saka chichava nekunamira kukuru kune dielectric zvinhu. Mishonga iyi inoitawo sechivhariso cheoxidation chinodzivirira kukora. Kana iyi mhangura inoshandiswa kugadzira laminate panels, rutivi rwakabatwa runosungirirwa kune dielectric, uye rutivi rwakasara rwakashata runoramba rwakafumurwa. Rutivi rwakafumurwa haruzoda imwe roughening isati yaiswa; inenge yatove nesimba rakakwana rekubatanidza kune rinotevera layer muPCB stackup.

Misiyano mitatu pane reverse yakarapwa foil yemhangura inosanganisira:

High tembiricha elongation (HTE) copper foil: Iyi i electrodeposited copper foil inoenderana ne IPC-4562 Grade 3 zvakatemwa. Chiso chakafumurwa chinobatwawo neoxidation barriers kudzivirira ngura panguva yekuchengetedza.
Kaviri-yakagadziriswa foil: Mune iyi foil yemhangura, kurapwa kunoshandiswa kumativi maviri efirimu. Nyaya iyi dzimwe nguva inodaidzwa kunzi drum-side treatment foil.
Resistive mhangura: Izvi hazviwanzo kurongeka semhangura yakabikwa pamusoro. Iyi foil yemhangura inoshandisa simbi yesimbi pamusoro pematte side remhangura, iyo inozoitwa rough kusvika padanho rinodiwa.
Kushandiswa kwepamusoro pekurapa mumidziyo iyi yemhangura kwakatwasuka: iyo foil inokungurutswa kuburikidza nekuwedzera mabhati e electrolyte anoshandisa yechipiri mhangura yekuisa, inoteverwa neyakavharira mhodzi, uye pakupedzisira anti-tarnish firimu layer.

PCB yemhangura foil

Surface kurapwa maitiro emhangura foils. [Kwakabva: Pytel, Steven G., et al. "Kuongororwa kwemishonga yemhangura uye migumisiro pakuparadzira zviratidzo." Muna 2008 58th Electronic Components uye Technology Musangano, mapeji 1144-1149. IEEE, 2008.]
Nematanho aya, une zvinhu zvinogona kushandiswa zviri nyore mune yakajairwa bhodhi yekugadzira maitiro ane kushoma kwekuwedzera kugadzirisa.

Yakakungurutswa-Annealed Mhangura

Mapepa emhangura akakungurutswa achapfuura mupumburu wemhangura foil kuburikidza nepeya yema rollers, iyo inotonhora-inotenderedza pepa remhangura kuhupamhi hunodiwa. Iyo roughness yeinoguma foil pepa ichasiyana zvichienderana nekutenderera paramita (kumhanya, kumanikidza, nezvimwewo).

Pepa rinoguma rinogona kunge rakatsetseka, uye mitsara inoonekwa pamusoro pepepa remhangura rakakungurutswa. Mifananidzo iri pasi apa inoratidza kuenzanisa pakati pe electrodeposited copper foil uye rolled-annealed foil.

PCB yemhangura foil kuenzanisa

Kuenzanisa kwe electrodeposited vs. rolled-annealed foils.
Yakaderera-Profile Mhangura
Iyi haisati iri mhando yefoiri yemhangura yaungagadzira neimwe nzira. Mhangura yakaderera ndeye electrodeposited mhangura iyo inorapwa uye inogadziridzwa ine micro-roughening maitiro kuti ipe yakaderera kwazvo paavhareji roughness ine roughening yakakwana yekunamatira kune substrate. Maitiro ekugadzira aya emhangura foil anowanzo kuve muridzi. Aya mafoiri anowanzo kurongerwa seyekupedzisira-yakaderera mbiri (ULP), yakaderera kwazvo mbiri (VLP), uye inongo dzika-mbiri (LP, ingangoita 1 micron avhareji roughness).

Zvinyorwa zvinoenderana:

Sei Copper Foil ichishandiswa muPCB Manufacturing?

Copper Foil Inoshandiswa muPrinted Circuit Board