Mune ramangwana 5G yekutaurirana michina, kushandiswa kwemhangura foil kuchawedzera kuwedzera, kunyanya munzvimbo dzinotevera:
1. High-Frequency PCBs (Akadhindwa Circuit Boards)
- Yakaderera Kurasikirwa Kwemhangura Foil: 5G yekukurumidzira yekukurumidzira uye yakaderera latency inoda yakakwira-frequency chiratidzo chekufambisa matekiniki mudhizaini bhodhi dhizaini, ichiisa zvakakwirira zvinoda pane zvinhu conductivity uye kugadzikana. Yakaderera kurasikirwa nemhangura foil, ine nzvimbo yakatsetseka, inoderedza kurasikirwa kwekupokana nekuda kwe "ganda rekuita" panguva yekufambisa kwechiratidzo, kuchengetedza chiratidzo chekuvimbika. Iyi foil yemhangura ichashandiswa zvakanyanya mu-high-frequency PCBs kune 5G base zviteshi uye antennas, kunyanya ayo anoshanda mumillimeter-wave frequencies (pamusoro pe30GHz).
- High Precision Copper Foil: Antennas uye RF modules mu5G zvishandiso zvinoda yakakwirira-chaiyo zvinhu kuti zvigadzirise kutapurirana kwechiratidzo uye kuita kwekugamuchira. Iyo yakakwirira conductivity uye machinability yefoil yemhanguraita ive sarudzo yakanakira miniaturized, yakakwirira-frequency antennas. Mu 5G millimeter-wave tekinoroji, uko maantenna ari madiki uye anoda yakakwirira-yekufambiswa kwechiratidzo kushanda zvakanaka, yakanyanya kutetepa, yakakwirira-chaiyo foil yemhangura inogona kuderedza zvakanyanya kuvharwa kwechiratidzo uye kuwedzera kushanda kweantenna.
- Conductor Material for Flexible Circuits: Munguva ye5G, zvigadziriso zvekutaurirana zvinosvika pakureruka, kutetepa, uye kushanduka-shanduka, zvichitungamira kushandiswa kwakapararira kweFPC muma smartphones, zvinopfekwa, uye smart home terminals. Copper foil, ine yakanakisa kuchinjika, conductivity, uye kuneta kuramba, yakakosha conductor zvinhu muFPC kugadzira, kubatsira maseketi kuwana kwakanyatso kubatanidza uye kutapurirana kwechiratidzo uchisangana neyakaomarara 3D wiring zvinodiwa.
- Ultra-Yatete Mhangura Foil yeMulti-Layer HDI PCBs: HDI tekinoroji yakakosha kune miniaturization uye yakakwirira kushanda kwe5G zvishandiso. HDI PCBs inowana yakakwirira yedunhu density uye masaini ekufambisa mareti kuburikidza newaya dzakakwenenzverwa uye maburi madiki. Maitiro e-ultra-thin copper foil (senge 9μm kana kutetepa) anobatsira kuderedza ukobvu hwebhodhi, kuwedzera chiratidzo chekufambisa kukurumidza uye kuvimbika, uye kuderedza njodzi yechiratidzo chemuchinjikwa. Iyo yekupedzisira-yakatetepa yemhangura foil ichashandiswa zvakanyanya mu5G smartphones, base zviteshi, uye marouters.
- Yakanyanya-Kushanda Kwekupisa Kupisa Kwemhangura Foil: Zvishandiso zve5G zvinogadzira kupisa kukuru panguva yekushanda, kunyanya kana uchibata zviratidzo zvepamusoro-soro uye mavhoriyamu makuru e data, izvo zvinoisa zvichemo zvakakwirira pakutarisira kupisa. Copper foil, ine yakanakisa yekupisa yekupisa, inogona kushandiswa mune zvinopisa zvimiro zve5G zvishandiso, senge thermal conductive sheets, dissipation films, kana thermal adhesive layers, zvichibatsira kukurumidza kutamisa kupisa kubva kunzvimbo yekupisa kuenda kunopisa kunyura kana zvimwe zvikamu, kusimbisa mudziyo kugadzikana uye hupenyu hurefu.
- Kushandisa muLTCC Modules: Mune 5G yekutaurirana michina, LTCC tekinoroji inoshandiswa zvakanyanya muRF kumberi-kuguma modules, mafirita, uye antenna arrays.Copper foil, ine maitiro ayo akanaka kwazvo, kuderera kwekudzivirira, uye nyore kwekugadzirisa, inowanzoshandiswa sechinhu chinonzi conductive layer muLTCC modules, kunyanya mumamiriro ekufambisa kwechiratidzo chepamusoro. Pamusoro pezvo, foil yemhangura inogona kuputirwa ne-anti-oxidation zvinhu kuti ivandudze kugadzikana kwayo uye kuvimbika panguva yeLTCC sintering process.
- Copper Foil yeMillimeter-Wave Radar Circuits: Millimeter-wave radar ine maapplication akawanda munguva ye5G, kusanganisira kutyaira kwega uye kuchengetedzeka kwakangwara. Aya ma radar anoda kushanda pama frequency akanyanya (kazhinji ari pakati pe24GHz ne77GHz).Copper foilinogona kushandiswa kugadzira iyo RF yedunhu mabhodhi uye antenna module mune radar masisitimu, ichipa yakanakisa chiratidzo kutendeseka uye kutapurirana kuita.
2. Miniature Antennas uye RF Modules
3. Flexible Printed Circuit Boards (FPCs)
4. High-Density Interconnect (HDI) Technology
5. Thermal Management
6. Yakaderera-Tembiricha Co-fired Ceramic (LTCC) Packaging Technology
7. Millimeter-Wave Radar Systems
Pakazara, kushandiswa kwemhangura foil mune ramangwana 5G yekutaurirana michina ichave yakakura uye yakadzika. Kubva pane yakakwirira-frequency chiratidzo chekufambisa uye yakakwirira-density yedunhu bhodhi kugadzira kune yekupisa manejimendi uye yekurongedza matekinoroji, ayo akawanda ekuita zvimiro uye kuita kwakatanhamara kunopa rutsigiro rwakakosha kune yakagadzikana uye inoshanda kushanda kwe5G zvishandiso.
Nguva yekutumira: Oct-08-2024