ED Mhangura Mapepa eFPC

Tsanangudzo Pfupi

Electrolytic copper foil yeFPC inogadzirwa zvakanyanya uye inogadzirirwa iyo FPC indasitiri (FCCL).Iyi electrolytic foil yemhangura ine zvirinani ductility, yakaderera roughness uye nani masvuura simba kupfuura mamwe foil emhangura.


Product Detail

Product Tags

Product Sumo

Electrolytic copper foil yeFPC inogadzirwa zvakanyanya uye inogadzirirwa iyo FPC indasitiri (FCCL).Iyi electrolytic foil yemhangura ine zvirinani ductility, yakaderera roughness uye nani masvuura simba kupfuura mamwe foil emhangura.Panguva imwecheteyo, kupedzisa kwepamusoro uye kunaka kwefoiri yemhangura kuri nani uye kupeta kupeta kuri nani pane zvigadzirwa zvakafanana zvemhangura.Sezvo iyi foil yemhangura inobva pane electrolytic process, haina mafuta, izvo zvinoita kuti zvive nyore kusanganiswa neTPI zvinhu pakupisa kwakanyanya.

Dimension Range

Ukobvu: 9µm~35µm

Performances

Chigadzirwa chepamusoro chakasviba kana chitsvuku, chine pasi pasi roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED yakavharwa nekristaro nhete firimu.

Features

Yakakwira density, yakakwirira kukotama kuramba uye yakanaka etching kuita.

Microstructure

1

SEM (Pamberi peKurapwa Kwepamusoro)

2

SEM (Shiny Side mushure meKurapwa)

3

SEM (Rutivi rwakakasharara mushure meKurapwa)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weight

g/m2

80±3

107±3

153±5

283±7

Tensile Simba

RT(23℃)

Kg/mm2

≥28

HT(180℃)

≥15

≥15

≥15

≥18

Elongation

RT(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

HT(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Kukasharara

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Simba

RT(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Mwero yakaderedzwa yeHCΦ(18%-1hr/25℃)

%

≤7.0

Shanduko yeruvara(E-1.0hr/200℃)

%

Kugona

Solder Inoyangarara 290 ℃

Sec.

≥20

Chitarisiko (Spot uye copper powder)

----

Hapana

Pinhole

EA

Zero

Saizi Kushivirira

Upamhi

mm

0~2mm

Urefu

mm

----

Core

Mm/inch

Mukati Diameter 79mm/3 inch

Cherechedza:1. Copper foil oxidation resistance performance uye surface density index inogona kutaurirana.

2. Indekisi yekushanda inoenderana nemaitiro edu ekuedza.

3. Nguva yekuvimbiswa kwehutano ndeyemazuva makumi mapfumbamwe kubva pazuva rekugamuchira.


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