Nekukurumidza kufambira mberi kwehunyanzvi, zvigadzirwa zvemagetsi zvave chikamu chakakosha chehupenyu hwezuva nezuva hwevanhu.Chips, se "moyo" wemidziyo yemagetsi, nhanho yega yega mukugadzira kwavo kwakakosha, uye foil yemhangura inoita basa rakakosha muindasitiri yekugadzira semiconductor.Nekushamisira kwayo kwemagetsi conductivity uye thermal conductivity, foil yemhangura ine huwandu hwakawanda hwekushandisa uye yakakosha mabasa.
Makiyi eKuitisa Nzira
Copper foilchimwe chezvinhu zvikuru zvinoshandiswa mukugadzirwa kwemapuranga edunhu akadhindwa (PCBs), ayo anoshanda semapuratifomu ekubatanidza machipisi nezvimwe zvinhu zvemagetsi.Mukuita uku, foil yemhangura yakavezwa zvine mutsindo kugadzira nzira dzakanaka dzekufambisa, dzinoshanda semigero yechiratidzo uye kutapurirana simba.Mukugadzira semiconductor, kungave kuri madiki-makonesheni mukati mechip kana kubatanidza kune yekunze nyika, foil yemhangura inoita sebhiriji.
Chombo chiri muThermal Management
Chizvarwa chekupisa panguva yekushanda kwechip hachidzivisiki.Nekupisa kwayo kwakanakisa, foil yemhangura inoita basa rakakosha mukutarisira kupisa.Iyo inonyatso fambisa kupisa kunogadzirwa ne chip, kuderedza chip thermal mutoro, nekudaro ichidzivirira kubva pakupisa kukuvadza uye kuwedzera hupenyu hwayo.
Cornerstone yePackaging uye Interconnection
Integrated circuit (IC) kurongedza inhanho yakakosha mukugadzira chip, uyefoil yemhangurainoshandiswa kubatanidza zvidiki zviri mukati me chip uye kumisikidza hukama nenyika yekunze.Izvi zvinongedzo hazvidi chete zvakanakisa magetsi conductivity asiwo zvakakwana simba remuviri uye kuvimbika, zvinodiwa izvo foil yemhangura inosangana zvakakwana.Inovimbisa kuti zviratidzo zvemagetsi zvinogona kuyerera zvakasununguka uye zvakarurama mukati uye kunze kwechip.
Zvishandiso Zvinodiwa zveMashandisirwo Epamusoro-Frequency
Mune yakakwirira-frequency kutaurirana matekinoroji akadai se5G uye iri kuuya 6G, foil yemhangura inonyanya kukosha nekuda kwekugona kwayo kuchengetedza yakanakisa conductivity pamhepo yakakwira.Yakakwira-frequency masaini anoisa zvichemo zvakakwirira pane conductivity uye kugadzikana kwezvinhu, uye kushandiswa kwemhangura foil kunovimbisa kushanda uye kugadzikana kwekufambiswa kwechiratidzo, zvichiita kuti ive chinhu chakakosha mukugadzira-frequency chip kugadzira.
Matambudziko uye Kubudirira Kweramangwana
Nyangwefoil yemhangurainoita basa rakakosha mukugadzira chip, sezvo chip tekinoroji ichiramba ichienda kune miniaturization uye kushanda kwepamusoro, zvinodiwa zvepamusoro zvinoiswa pamhando uye tekinoroji yekugadzirisa yemhangura foil.Hukobvu, kuchena, kufanana, uye kugadzikana kwekuita kwayo pasi pemamiriro akanyanya matambudziko ese ehunyanzvi ayo vagadziri vanofanirwa kukunda.
Tichitarisa mberi, nekuvandudzwa kwezvinhu zvitsva uye maitiro, kushandiswa uye basa remhangura foil muindasitiri yekugadzira semiconductor ichawedzerwa nekudzika.Kunyangwe iri kusimudzira chip performance, optimize thermal management solution, kana kusangana nezvinodiwa zve-high-frequency application, foil yemhangura icharamba ichiita basa risingadzokerike, richitsigira kuenderera mberi uye kusimukira kweindasitiri yekugadzira semiconductor.
Nguva yekutumira: Mar-28-2024