< img height="1" width="1" style="display:none" src="https://www.facebook.com/tr?id=1663378561090394&ev=PageView&noscript=1" /> Yakanakisa ED Mhangura Mafoiri eFPC Mugadziri uye Fekitori | Civen

ED Mhangura Mafuta eFPC

Tsanangudzo Pfupi

FCF, inochinjikafoil yemhangura yakagadziridzwa uye inogadzirirwa iyo FPC indasitiri (FCCL). Iyi electrolytic copper foil ine zvirinani ductility, yakaderera roughness uye nani peel simba kupfuurazvimwe foil yemhanguras. Panguva imwecheteyo, kupedzisa kwepamusoro uye kunaka kwefoiri yemhangura zviri nani uye kupeta kupeta ndikowozviri nani pane zvakafanana zvigadzirwa zvemhangura foil. Sezvo iyi foil yemhangura inobva pane electrolytic process, haina mafuta, izvo zvinoita kuti zvive nyore kusanganiswa neTPI zvinhu pakupisa kwakanyanya.


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Product Tags

Product Sumo

FCF, inochinjikafoil yemhangura yakagadziridzwa uye inogadzirirwa iyo FPC indasitiri (FCCL). Iyi electrolytic copper foil ine zvirinani ductility, yakaderera roughness uye nani peel simba kupfuurazvimwe foil yemhanguras. Panguva imwecheteyo, kupedzisa kwepamusoro uye kunaka kwefoiri yemhangura zviri nani uye kupeta kupeta ndikowozviri nani pane zvakafanana zvigadzirwa zvemhangura foil. Sezvo iyi foil yemhangura inobva pane electrolytic process, haina mafuta, izvo zvinoita kuti zvive nyore kusanganiswa neTPI zvinhu pakupisa kwakanyanya.

Dimension Range:

Ukobvu:9µm35µm

Performance

Chigadzirwa chepamusoro chakasviba kana chitsvuku, chine pasi pasi roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED yakavharwa nekristaro nhete firimu.

Features:

Yakakwira density, yakakwirira kukotama kuramba uye yakanaka etching kuita.

Microstructure:

ED Mhangura Mafurati eFPC3

SEM (Rutivi rwakakasharara mushure meKurapwa)

ED Mhangura Mapepa eFPC2

SEM (Pamberi peKurapwa Kwepamusoro)

ED Mhangura Mapepa eFPC1

SEM (Shiny Side mushure meKurapwa)

Table1- Performance (GB/T5230-2000、IPC-4562-2000):

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weight

g/m2

80±3

107±3

153±5

283±7

Tensile Simba

RT(23℃)

Kg/mm2

≥28

HT(180℃)

≥15

≥15

≥15

≥18

Elongation

RT(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

HT(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Kukasharara

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Simba

RT(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Mwero yakaderedzwa yeHCΦ(18%-1hr/25℃)

%

≤7.0

Shanduko yeruvara(E-1.0hr/200℃)

%

Kugona

Solder Inoyangarara 290 ℃

Sec.

≥20

Chitarisiko (Spot uye copper powder)

----

Hapana

Pinhole

EA

Zero

Saizi Kushivirira

Upamhi

mm

0 ~ 2mm

Urefu

mm

----

Core

Mm/inch

Mukati Diameter 79mm/3 inch

Cherechedza: 1. Copper foil oxidation resistance performance uye surface density index inogona kutaurirana.

2. Indekisi yekushanda inoenderana nemaitiro edu ekuedza.

3. Nguva yekuvimbiswa kwehutano ndeyemazuva makumi mapfumbamwe kubva pazuva rekugamuchira.


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