ED Copper Foils yeFPC
Nhanganyaya yeChigadzirwa
FCF, inochinjikafoil yemhangura yakagadzirwa uye inogadzirwa zvakanangana neindasitiri yeFPC (FCCL). Iyi foil yemhangura ine electrolytic ine ductility iri nani, roughness yakaderera uye simba riri nani rekubvisa mavanga kupfuurazvimwe foil yemhangurasPanguva imwe chete, kupenya kwepamusoro uye kupfava kwepepa remhangura kuri nani uye kuramba kupetwa kuri nani.zvakarezviri nani pane zvigadzirwa zvakafanana zve copper foil. Sezvo copper foil iyi yakavakirwa pa electrolytic process, haina mafuta, izvo zvinoita kuti zvive nyore kusanganiswa nezvinhu zveTPI pakupisa kwakanyanya.
Range yeDimension:
Ukobvu:9µm～35µm
Kushanda
Chigadzirwa chacho chakasviba kana kuti chitsvuku, chine hukasha hwakaderera pamusoro.
Mashandisirwo
Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, firimu rakatetepa rakaputirwa ne LED.
Zvimiro:
Kuwanda kwesimbi, kuramba kukotama kwakanyanya uye kushanda zvakanaka kwekucheka.
Magadzirirwo emukati memuviri:
SEM (Rutivi Rusina Kunaka Mushure meKurapwa)
SEM (Kurapwa Kwepamusoro Pamberi)
SEM (Rutivi Runopenya Mushure meKurapwa)
Tafura 1- Kushanda (GB/T5230-2000、IPC-4562-2000):
| Kupatsanura | Chikamu | 9μm | 12μm | 18μm | 35μm | |
| Zvemukati zveCu | % | ≥99.8 | ||||
| Huremu hweNzvimbo | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | |
| Simba reKusimba | RT(23℃) | Kg/mm2 | ≥28 | |||
| HT(180℃) | ≥15 | ≥15 | ≥15 | ≥18 | ||
| Kureba | RT(23℃) | % | ≥5.0 | ≥5.0 | ≥6.0 | ≥10 |
| HT(180℃) | ≥6.0 | ≥6.0 | ≥8.0 | ≥8.0 | ||
| Kuomarara | Kupenya(Ra) | μm | ≤0.43 | |||
| Matte(Rz) | ≤2.5 | |||||
| Simba rekubvisa ganda | RT(23℃) | kg/cm | ≥0.77 | ≥0.8 | ≥0.8 | ≥0.8 |
| Mwero weHCΦ wakaderera (18%-1hr/25℃) | % | ≤7.0 | ||||
| Kuchinja kweruvara (E-1.0hr/200℃) | % | Kugona | ||||
| Solder Inoyangarara 290℃ | Chikamu. | ≥20 | ||||
| Chitarisiko (Spot uye upfu hwemhangura) | ---- | Hapana | ||||
| Hole yePin | EA | Zero | ||||
| Kushivirira Kukura | Upamhi | mm | 0~2mm | |||
| Kureba | mm | ---- | ||||
| Core | Mm/inch | Dhayamita yemukati 79mm/3 inch | ||||
Cherechedza: 1. Kushanda kweCopper foil oxidation resistance uye surface density index zvinogona kutaurirana.
2. Ruzivo rwekushanda rwunoenderana nenzira yedu yekuedza.
3. Nguva yevimbiso yemhando ndeyemazuva makumi mapfumbamwe kubva pazuva rekugamuchira.
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