[HTE] High Elongation ED Copper Foil
![[HTE] High Elongation ED Copper Foil Featured Image](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil.png)
Product Sumo
HTE, kupisa kwakanyanya uye kureba foil yemhangura inogadzirwa neCIVEN METALine kupikisa kwakanyanya kune tembiricha yepamusoro uye yakakwirira ductility.Iyo foil yemhangura haina oxidize kana kushandura ruvara pakupisa kwakanyanya, uye iyo yakanaka ductility inoita kuti zvive nyore kuisa laminate nezvimwe zvinhu.Iyo foil yemhangura inogadzirwa neiyo electrolysis process ine yakanyanya kuchena pamusoro uye flat sheet chimiro.Iyo foil yemhangura pachayo yakaomeswa kune rumwe rutivi, izvo zvinoita kuti zvive nyore kuomerera kune zvimwe zvinhu.Kuchena kwese kwefoiri yemhangura kwakakwira zvakanyanya, uye ine yakanakisa magetsi uye yekupisa conductivity.Kuti tisangane nezvinodiwa nevatengi vedu, isu hatigone kupa kwete chete mipumburu yemhangura foil, asiwo customized slicing masevhisi.
Zvinotsanangurwa
Ukobvu: 1/4OZ～20OZ(9µm～70µm)
Kureba: 550mm～1295mm
Performance
Chigadzirwa chacho chine yakanakisa kamuri yekuchengetera tembiricha kuita, yakanyanya tembiricha oxidation kuramba kuita, mhando yechigadzirwa kusangana ne IPC-4562 yakajairwa.Ⅱ, Ⅲzvinodiwa pamwero.
Applications
Inokodzera marudzi ese eresin system yeaviri-mativi, multilayer akadhindwa redunhu bhodhi
Zvakanakira
Chigadzirwa chacho chinotora nzira yakakosha yekurapa kwepamusoro kuvandudza kugona kwechigadzirwa kuramba kudzika kwepasi uye kuderedza njodzi yekusara kwemhangura.
Kuita(GB/T5230-2000、IPC-4562-2000)
| Classification | Unit | 1/4OZ (9μm) | 1/3OZ (12μm) | J OZ (15μm) | 1/2OZ (18μm) | 1OZ (35μm) | 2OZ (70μm) | |
| Cu Content | % | ≥99.8 | ||||||
| Area Weight | g/m2 | 80±3 | 107±3 | 127±4 | 153±5 | 283±5 | 585±10 | |
| Tensile Simba | RT(25℃) | Kg/mm2 | ≥28 | ≥30 | ||||
| HT(180℃) | ≥15 | |||||||
| Elongation | RT(25℃) | % | ≥4.0 | ≥5.0 | ≥6.0 | ≥10 | ||
| HT(180℃) | ≥4.0 | ≥5.0 | ≥6.0 | |||||
| Kukasharara | Shiny(Ra) | μm | ≤0.4 | |||||
| Matte(Rz) | ≤5.0 | ≤6.0 | ≤7.0 | ≤7.0 | ≤9.0 | ≤14 | ||
| Peel Simba | RT(23℃) | Kg/cm | ≥1.0 | ≥1.2 | ≥1.2 | ≥1.3 | ≥1.8 | ≥2.0 |
| Mwero yakaderedzwa yeHCΦ(18%-1hr/25℃) | % | ≤5.0 | ||||||
| Shanduko yeruvara(E-1.0hr/190℃) | % | Kugona | ||||||
| Solder Inoyangarara 290 ℃ | Sec. | ≥20 | ||||||
| Pinhole | EA | Zero | ||||||
| Preperg | ---- | FR-4 | ||||||
Cherechedza:1. Ukoshi hweRz hwemhangura foil gross surface ndiyo bvunzo yakagadzikana kukosha, kwete kukosha kwakavimbiswa.
2. Peel simba ndiyo yakajairwa FR-4 board test value (5 mapepa e7628PP).
3. Nguva yekusimbisa hutano ndeyemazuva makumi mapfumbamwe kubva pazuva rekugamuchira.
![[RTF] Reverse Yakabatwa ED Copper Foil](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil-300x300.png)
![[VLP] Yakanyanya Yakaderera Mbiri ED Copper Foil](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
![[BCF] Bhatiri ED Copper Foil](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
