Yakavharidzirwa ED Copper Foils
Product Sumo
STD yakajairwa foil yemhangura inogadzirwa neCIVEN METAL haina kungoita zvakanaka magetsi nekuda kwekuchena kwemhangura, asi zvakare iri nyore kuisa uye inogona kudzivirira zvinobudirira masaini emagetsi uye kukanganiswa kwemicrowave.Iyo electrolytic yekugadzira maitiro inobvumira hupamhi hwehupamhi hwemamita 1.2 kana kupfuura, ichibvumira kuchinjika maapplication munzvimbo dzakasiyana siyana.Iyo foil yemhangura pachayo ine chimiro chakadzika kwazvo uye inogona kunyatsoumbwa kune zvimwe zvinhu.Iyo foil yemhangura zvakare inoshingirira kune yakakwirira-tembiricha oxidation uye corrosion, ichiita kuti ive yakakodzera kushandiswa munzvimbo dzakaoma kana kune zvigadzirwa zvine zvakaomesesa zvehupenyu zvinodiwa.
Zvinotsanangurwa
CIVEN inogona kupa 1/3oz-4oz (nominal ukobvu 12μm -140μm) inodzivirira electrolytic copper foil ine hupamhi hwehupamhi hwe1290mm, kana dzakasiyana siyana dzekudzivirira electrolytic foil yemhangura ine ukobvu hwe12μm -140μm zvinoenderana nezvinodiwa nevatengi nemhando yechigadzirwa inosangana ne zvinodiwa zveIPC-4562 standard II uye III.
Performance
Haisi chete ine yakanakisa yemuviri zvimiro zveequiaxial yakanaka crystal, yakaderera chimiro, yakakwirira simba uye yakakwira elongation, asi zvakare ine yakanaka kunyorova, makemikari kuramba, kupisa conductivity uye UV kuramba, uye inokodzera kudzivirira kukanganiswa ne static magetsi uye kudzvinyirira electromagnetic. masaisai, nezvimwewo.
Applications
Inokodzera motokari, simba remagetsi, kutaurirana, mauto, aerospace uye mamwe makuru-simba redunhu bhodhi, yakakwirira-frequency bhodhi kugadzira, uye transformers, tambo, mbozhanhare, makombiyuta, zvokurapa, aerospace, mauto uye zvimwe zvigadzirwa zvemagetsi shielding.
Zvakanakira
1, Nekuda kwemaitiro akakosha enzvimbo yedu yekuomesera, inogona kudzivirira kuparara kwemagetsi.
2, Nekuti chimiro chezviyo chezvigadzirwa zvedu chakaenzana chekristaro spherical, chinopfupisa nguva yekumisikidza mutsara uye inonatsiridza dambudziko rekusaenzana kwemutsara wepadivi etching.
3, nepo iine yakakwira peel simba, pasina mhangura yehupfu yekufambisa, yakajeka magirafu PCB yekugadzira kuita.
Kuita(GB/T5230-2000、IPC-4562-2000)
| Classification | Unit | 9μm | 12μm | 18μm | 35μm | 50μm | 70μm | 105μm | |
| Cu Content | % | ≥99.8 | |||||||
| Area Weight | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | 440±8 | 585±10 | 875±15 | |
| Tensile Simba | RT(23℃) | Kg/mm2 | ≥28 | ||||||
| HT(180℃) | ≥15 | ≥18 | ≥20 | ||||||
| Elongation | RT(23℃) | % | ≥5.0 | ≥6.0 | ≥10 | ||||
| HT(180℃) | ≥6.0 | ≥8.0 | |||||||
| Kukasharara | Shiny(Ra) | μm | ≤0.43 | ||||||
| Matte(Rz) | ≤3.5 | ||||||||
| Peel Simba | RT(23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.9 | ≥1.0 | ≥1.0 | ≥1.5 | ≥2.0 |
| Mwero yakaderedzwa yeHCΦ(18%-1hr/25℃) | % | ≤7.0 | |||||||
| Shanduko yeruvara(E-1.0hr/200℃) | % | Kugona | |||||||
| Solder Inoyangarara 290 ℃ | Sec. | ≥20 | |||||||
| Chitarisiko (Spot uye copper powder) | ---- | Hapana | |||||||
| Pinhole | EA | Zero | |||||||
| Saizi Kushivirira | Upamhi | 0~2mm | 0~2mm | ||||||
| Urefu | ---- | ---- | |||||||
| Core | Mm/inch | Mukati Diameter 76mm/3 inch | |||||||
Cherechedza:1. Ukoshi hweRz hwemhangura foil gross surface ndiyo bvunzo yakagadzikana kukosha, kwete kukosha kwakavimbiswa.
2. Peel simba ndiyo yakajairwa FR-4 board test value (5 mapepa e7628PP).
3. Nguva yekusimbisa hutano ndeyemazuva makumi mapfumbamwe kubva pazuva rekugamuchira.
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