[RTF] Reverse Yakabatwa ED Copper Foil
![[RTF] Reverse Yakabatwa ED Copper Foil Featured Image](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil.png)
Product Sumo
RTF, reverse yakabatwa electrolytic copper foil ifoiri yemhangura yakaomeswa kuita madhigirii akasiyana mativi ese. Izvi zvinosimbisa kusimba kwepeel yemativi ese maviri efoiri yemhangura, zvichiita kuti zvive nyore kushandisa senge yepakati dhizaini yekubatanidza kune zvimwe zvinhu. Uyezve, mazinga akasiyana-siyana ekurapa kumativi ose efoiri yemhangura anoita kuti zvive nyore kuisa rutivi rwakatetepa rweganda rakaomeswa. Muchigadziro chekugadzira bhodhi redunhu rakadhindwa (PCB) panhizha, rutivi rwakabatwa rwemhangura runoshandiswa kune dielectric material. Iro divi redhiramu rakabatwa rakakasharara kupfuura rimwe divi, iro rinoumba kunamira kukuru kune dielectric. Iyi ndiyo mukana mukuru pane yakajairwa electrolytic mhangura. Rutivi rwematte harudi chero mechanical kana makemikari kurapwa isati yashandiswa photoresist. Yatove yakakasharara zvakakwana kuti ive yakanaka laminating kuramba adhesion.
Zvinotsanangurwa
CIVEN inokwanisa kupa RTF electrolytic copper foil ine nominella ukobvu hwe12 kusvika 35µm kusvika paupamhi hwe1295mm.
Performance
Iyo yakanyanya tembiricha yekurebesa yakadzoserwa yakabatwa electrolytic yemhangura foil inoiswa kune chaiyo plating maitiro kudzora saizi yemamota emhangura uye nekuagovera zvakaenzana. Iyo yakadzoserwa yakagadziriswa inopenya pamusoro pefoiri yemhangura inogona kuderedza zvakanyanya kushata kwefoiri yemhangura yakatsikirirwa pamwe chete uye inopa yakakwana peel simba refoiri yemhangura. (Ona Tafura 1)
Applications
Inogona kushandiswa kune yakakwira-frequency zvigadzirwa uye emukati laminates, senge 5G base zviteshi uye mota radar uye zvimwe zvishandiso.
Zvakanakira
Yakanaka yekubatanidza simba, yakananga yakawanda-layer lamination, uye yakanaka etching kuita. Iyo inoderedza zvakare mukana weiyo pfupi dunhu uye inopfupisa iyo process cycle nguva.
Tafura 1. Kuita
| Classification | Unit | 1/3OZ (12μm) | 1/2OZ (18μm) | 1OZ (35μm) | |
| Cu Content | % | min. 99.8 | |||
| Area Weight | g/m2 | 107±3 | 153±5 | 283±5 | |
| Tensile Simba | RT(25℃) | Kg/mm2 | min. 28.0 | ||
| HT(180℃) | min. 15.0 | min. 15.0 | min. 18.0 | ||
| Elongation | RT(25℃) | % | min. 5.0 | min. 6.0 | min. 8.0 |
| HT(180℃) | min. 6.0 | ||||
| Kukasharara | Shiny(Ra) | μm | max. 0.6/4.0 | max. 0.7/5.0 | max. 0.8/6.0 |
| Matte(Rz) | max. 0.6/4.0 | max. 0.7/5.0 | max. 0.8/6.0 | ||
| Peel Simba | RT(23℃) | Kg/cm | min. 1.1 | min. 1.2 | min. 1.5 |
| Mwero yakaderedzwa yeHCΦ(18%-1hr/25℃) | % | max. 5.0 | |||
| Shanduko yeruvara(E-1.0hr/190℃) | % | Hapana | |||
| Solder Inoyangarara 290 ℃ | Sec. | max. 20 | |||
| Pinhole | EA | Zero | |||
| Preperg | ---- | FR-4 | |||
Cherechedza:1. Ukoshi hweRz hwemhangura foil gross surface ndiyo bvunzo yakagadzikana kukosha, kwete kukosha kwakavimbiswa.
2. Peel simba ndiyo yakajairwa FR-4 board test value (5 mapepa e7628PP).
3. Nguva yekusimbisa hutano ndeyemazuva makumi mapfumbamwe kubva pazuva rekugamuchira.
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