< img urefu="1" width="1" style="display:none" src="https://www.facebook.com/tr?id=1663378561090394&ev=PageView&noscript=1" /> Mugadziri wepamusoro we [RTF] Reverse Treated ED Copper Foil uye Fekitori | Civen

[RTF] Foiri yemhangura yeED Yakagadziriswazve

Tsananguro pfupi:

RTF, rnguva dzosekurapwaElectrolytic copper foil ifoil yemhangura yakakangwa kusvika padanho rakasiyana-siyana kumativi ese. Izvi zvinosimbisa simba remakanda emativi ese ecopper foil, zvichiita kuti zvive nyore kushandisa sechikamu chepakati chekubatanidza kune zvimwe zvinhu. Uyezve, mazinga akasiyana ekugadzirisa kumativi ese ecopper foil anoita kuti zvive nyore kucheka divi rakatetepa recornered layer. Mukugadzira printed circuit board (PCB) panel, divi rakagadziriswa recopper rinoiswa kune dielectric material. Rutivi rwedhiramu rakagadziriswa rakakangwa kupfuura rumwe rutivi, izvo zvinoita kuti rinamatire zvakanyanya kune dielectric. Iri ndiro mukana mukuru pane standard electrolytic copper. Rutivi rwakakangwa harudi chero mechanical kana chemical treatment usati washandisa photoresist. Rwakatokwana zvakakwana kuti ruve nelaminating resist adhesion yakanaka.


Ruzivo rweChigadzirwa

Matagi eChigadzirwa

Nhanganyaya yeChigadzirwa

RTF, reverse treated electrolytic copper foil ifoil yemhangura yakakangwa kusvika padanho rakasiyana kumativi ese. Izvi zvinosimbisa simba remakanda emativi ese ecopper foil, zvichiita kuti zvive nyore kushandisa sechikamu chepakati chekubatanidza kune zvimwe zvinhu. Uyezve, mazinga akasiyana ekugadzirisa kumativi ese ecopper foil anoita kuti zvive nyore kucheka divi rakatetepa recornered layer. Mukugadzira printed circuit board (PCB) panel, divi rakagadziriswa recopper rinoiswa kune dielectric material. Rutivi rwedhiramu rakagadziriswa rakakangwa kupfuura rumwe rutivi, izvo zvinoita kuti rinamatire zvakanyanya kune dielectric. Iri ndiro mukana mukuru pane standard electrolytic copper. Rutivi rwakakangwa harudi chero mechanical kana chemical treatment usati washandisa photoresist. Rwakatokwana zvakakwana kuti ruve ne laminating resist adhesion yakanaka.

Magadzirirwo

CIVEN inogona kupa RTF electrolytic copper foil ine ukobvu hwe12 kusvika 35µm kusvika 1295mm.

Kushanda

Foil yemhangura yakadzoserwa yakagadziriswa inoiswa muchimiro chakanyatsogadzirwa kuti idzore saizi yemabundu emhangura uye igovane zvakaenzana. Pamusoro pefoil yemhangura yakadzoserwa yakagadziriswa inogona kuderedza zvakanyanya kuomarara kwefoil yemhangura yakasungirirwa pamwe chete uye kupa simba rakakwana refoil yemhangura. (Ona Tafura 1)

Mashandisirwo

Inogona kushandiswa pakugadzira zvinhu zvinoshandisa mafrequency akawanda uye ma inner laminates, zvakaita se 5G base stations uye mota ye radar nezvimwe zvishandiso.

Zvakanakira

Simba rakanaka rekubatanidza, lamination yakananga ine machira akawanda, uye kushanda zvakanaka kwekucheka. Inoderedzawo mukana wekuti pave ne "short circuit" uye inopfupisa nguva ye "process cycle".

Tafura 1. Kushanda

Kupatsanura

Chikamu

1/3OZ

(12μm)

1/2OZ

(18μm)

1OZ

(35μm)

Zvemukati zveCu

%

miniti 99.8

Huremu hweNzvimbo

g/m2

107±3

153±5

283±5

Simba reKusimba

RT (25℃)

Kg/mm2

miniti 28.0

HT(180℃)

miniti 15.0

miniti 15.0

miniti 18.0

Kureba

RT (25℃)

%

miniti 5.0

miniti 6.0

miniti 8.0

HT(180℃)

miniti 6.0

Kuomarara

Kupenya(Ra)

μm

0.6/4.0 yakakwira

0.7/5.0 yakakwira

0.8/6.0 yakakwira

Matte(Rz)

0.6/4.0 yakakwira

0.7/5.0 yakakwira

0.8/6.0 yakakwira

Simba rekubvisa ganda

RT(23℃)

kg/cm

miniti 1.1

miniti 1.2

miniti 1.5

Mwero weHCΦ wakaderera (18%-1hr/25℃)

%

5.0 yepamusoro

Kuchinja kweruvara (E-1.0hr/190℃)

%

Hapana

Solder Inoyangarara 290℃

Chikamu.

20 yepamusoro

Hole yePin

EA

Zero

Preperg

----

FR-4

Cherechedza:1. Kukosha kweRz kwepombi yemhangura ndiyo kukosha kwakasimba kwekuyedza, kwete kukosha kwakavimbiswa.

2. Simba rekubvisa mapeel ndiro chiyero chebvunzo yeFR-4 board (mapepa mashanu e7628PP).

3. Nguva yekuvimbisa hunhu hwezvinhu mazuva makumi mapfumbamwe kubva pazuva rekugamuchira.


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