Tin Plated Copper Foil
Product Sumo
Zvigadzirwa zvemhangura zvinoratidzwa mumhepo zvinowanzoitikaoxidationuye kuumbwa kwekutanga kwemhangura carbonate, iyo ine kukwirira kwepamusoro, kusagadzikana kwemagetsi ekufambisa uye kurasikirwa kwekufambisa kwemasimba makuru; mushure mekugadzira tin, zvigadzirwa zvemhangura zvinogadzira tin dioxide mafirimu mumhepo nekuda kwezvinhu zvesimbi simbi pachayo kudzivirira imwe oxidation.
Base Material
●High-precision Yakakungurutswa Copper Foil, Cu(JIS: C1100/ASTM: C11000) zvirimo zvinopfuura 99.96%
Base Material Kukobvu Range
●0.035mm~0.15mm (0.0013 ~0.0059inches)
Base Material Width Range
●≤300mm (≤11.8 inches)
Base Material Temper
●Maererano nezvinodiwa nevatengi
Application
●Zvishandiso zvemagetsi uye indasitiri yemagetsi, zvechivanhu (zvakadai se: chinwiwa kurongedza uye chikafu chekubata maturusi);
Performance Parameters
| Items | Weldable Tin Plating | Non-weld Tin Plating |
| Width Range | ≤600mm (≤23.62inches) | |
| Makobvu Range | 0.012~0.15mm (0.00047inches~0.0059inches) | |
| Tin layer Hukobvu | ≥0.3µm | ≥0.2µm |
| Tin Content yeTin Layer | 65 ~ 92% (Inogona kugadzirisa tin zvemukati zvinoenderana nemutengi welding process) | 100% Pure Tin |
| Surface Resistance yeTin Layer(Ω) | 0.3~0.5 | 0.1~0.15 |
| Adhesion | 5B | |
| Tensile Simba | Base Material Performance Attenuation mushure mePlating ≤10% | |
| Elongation | Base Material Performance Attenuation mushure mePlating ≤6% | |
