[VLP] Yakanyanya Yakaderera Mbiri ED Copper Foil
![[VLP] Yakanyanya Yakaderera Mbiri ED Copper Foil Inoratidzwa Mufananidzo](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil.png)
Product Sumo
VLP, yakaderera kwazvo profil electrolytic copper foil inogadzirwa neCIVEN METAL ine hunhu hwekushata kwakaderera uye kusimba kwepeel. Iyo foil yemhangura inogadzirwa neiyo electrolysis process ine zvakanakira kuchena kwepamusoro, kusvibiswa kwakaderera, nzvimbo yakatsetseka, flat board shape, uye yakakura upamhi. Iyo electrolytic mhangura foil inogona kuve yakanyudzwa zvirinani nezvimwe zvinhu mushure mekuomeswa kune rimwe divi, uye hazvisi nyore kupepeta.
Zvinotsanangurwa
CIVEN inogona kupa Ultra-yakaderera chimiro chepamusoro tembiricha ductile electrolytic copper foil (VLP) kubva 1/4oz kusvika 3oz (nominal ukobvu 9µm kusvika 105µm), uye yakakura chigadzirwa saizi i1295mm x 1295mm sheet copper foil.
Performance
CIVEN inopa yakanyanya-yakakora electrolytic yemhangura foil ine yakanakisa yemuviri zvimiro zveequiaxial yakanaka crystal, yakaderera mbiri, yakakwirira simba uye yakakwirira kureba. (Ona Tafura 1)
Applications
Inoshanda pakugadzirwa kwepamusoro-simba redunhu mabhodhi uye mabhodhi epamusoro-soro emotokari, simba remagetsi, kutaurirana, mauto uye aerospace.
Hunhu
Kuenzanisa nezvigadzirwa zvekunze zvakafanana.
1.Chimiro chezviyo cheVLP yedu electrolytic copper foil is equiaxed fine crystal spherical; nepo chimiro chezviyo chezvigadzirwa zvekunze zvakafanana chiri columnar uye kureba.
2. Electrolytic copper foil is ultra-low profile, 3oz copper foil gross surface Rz ≤ 3.5µm; nepo zvigadzirwa zvekunze zvakafanana zvakajairwa chimiro, 3oz copper foil gross surface Rz> 3.5µm.
Zvakanakira
1.Sezvo chigadzirwa chedu chiri ultra-low profile, chinogadzirisa njodzi inogona kuitika yemutsara mupfupi wedunhu nekuda kwekukasharara kweyakajairwa gobvu foil yemhangura uye kupinda nyore kwepepa rakatetepa rekudzivirira ne "wolf zino" paunenge uchidzvanya. mativi maviri-mativi panel.
2.Nekuda kwekuti chimiro chezviyo chezvigadzirwa zvedu chakaenzana nekristaro yakanaka spherical, inopfupisa nguva yekugadzira mutsara uye inovandudza dambudziko rekusaenzana kwemutsara weparutivi etching.
3, nepo iine yakakwira peel simba, pasina mhangura yehupfu yekufambisa, yakajeka magirafu PCB yekugadzira kuita.
Kuita(GB/T5230-2000、IPC-4562-2000)
| Classification | Unit | 9μm | 12μm | 18μm | 35μm | 70μm | 105μm | |
| Cu Content | % | ≥99.8 | ||||||
| Area Weight | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | 585±10 | 875±15 | |
| Tensile Simba | RT(23℃) | Kg/mm2 | ≥28 | |||||
| HT(180℃) | ≥15 | ≥18 | ≥20 | |||||
| Elongation | RT(23℃) | % | ≥5.0 | ≥6.0 | ≥10 | |||
| HT(180℃) | ≥6.0 | ≥8.0 | ||||||
| Kukasharara | Shiny(Ra) | μm | ≤0.43 | |||||
| Matte(Rz) | ≤3.5 | |||||||
| Peel Simba | RT(23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.9 | ≥1.0 | ≥1.5 | ≥2.0 |
| Mwero yakaderedzwa yeHCΦ(18%-1hr/25℃) | % | ≤7.0 | ||||||
| Shanduko yeruvara(E-1.0hr/200℃) | % | Kugona | ||||||
| Solder Inoyangarara 290 ℃ | Sec. | ≥20 | ||||||
| Chitarisiko (Spot uye copper powder) | ---- | Hapana | ||||||
| Pinhole | EA | Zero | ||||||
| Saizi Kushivirira | Upamhi | mm | 0 ~ 2mm | |||||
| Urefu | mm | ---- | ||||||
| Core | Mm/inch | Mukati Diameter 79mm/3 inch | ||||||
Cherechedza:1. Ukoshi hweRz hwemhangura foil gross surface ndiyo bvunzo yakagadzikana kukosha, kwete kukosha kwakavimbiswa.
2. Peel simba ndiyo yakajairwa FR-4 board test value (5 mapepa e7628PP).
3. Nguva yekusimbisa hutano ndeyemazuva makumi mapfumbamwe kubva pazuva rekugamuchira.
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