[VLP] Foiri yemhangura yeED isina chimiro chakanyanya
![[VLP] Mufananidzo Wakaratidzwa weED Copper Foil usina kusimba zvakanyanya](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil.png)
Nhanganyaya yeChigadzirwa
VLP, jira remhangura rine electrolytic rakaderera zvikuru rinogadzirwa neCIVEN METAL rine hunhu hwekusakora kwakaderera uye simba guru remabvi. jira remhangura rinogadzirwa ne electrolysis rine zvakanakira zvekuchena kwakanyanya, kusviba kwakaderera, pamusoro pakanyatsotsetseka, chimiro chebhodhi rakatsetseka, uye upamhi hwakakura. jira remhangura rine electrolytic rinogona kunamirwa zviri nani nezvimwe zvinhu mushure mekukweshana kune rumwe rutivi, uye hazvisi nyore kubvisa.
Magadzirirwo
CIVEN inogona kupa foil yemhangura ine ductile electrolytic copper foil (VLP) ine ultra-low profile high temperature kubva pa 1/4oz kusvika pa 3oz (nominal thickness 9µm kusvika pa 105µm), uye saizi yepamusoro yechigadzirwa i1295mm x 1295mm sheet copper foil.
Kushanda
CIVEN inopa foil yemhangura yakakora kwazvo ine hunhu hwakanaka hwekristaro yakanaka, chimiro chakaderera, simba rakawanda uye kureba kwakakwirira. (Ona Tafura 1)
Mashandisirwo
Inoshanda pakugadzira mabhodhi emagetsi ane simba guru uye mabhodhi ane simba guru rekufambisa mota, magetsi, kutaurirana, zvemauto uye zvemuchadenga.
Hunhu
Kuenzanisa nezvigadzirwa zvekunze zvakafanana.
1. Chimiro chezviyo cheVLP electrolytic copper foil yedu chakaenzana nekristaro yakatsetseka; nepo chimiro chezviyo chezvigadzirwa zvakafanana zvekunze chiri columnar uye chakareba.
2. Foiri yemhangura ine electrolytic ine chimiro chakaderera zvakanyanya, 3oz copper foil gross surface Rz ≤ 3.5µm; nepo zvigadzirwa zvakafanana zvekunze zviri zvemhando yepamusoro, 3oz copper foil gross surface Rz > 3.5µm.
Zvakanakira
1. Sezvo chigadzirwa chedu chisina chimiro chakanyanya, chinogadzirisa njodzi inogona kuitika yemutsara mupfupi nekuda kwekuoma kukuru kwefoil yemhangura yakakora uye kupinda nyore kwepepa rakatetepa rekudzivirira kupisa ne "wolf tooth" kana uchidzvanya panel ine mativi maviri.
2. Nekuti chimiro chezviyo zvezvigadzirwa zvedu chakaenzana nekristaro yakanaka, chinopfupisa nguva yekuchekwa kwemitsara uye chinovandudza dambudziko rekuchekwa kwemativi asina kuenzana kwemitsara.
3, nepo iine simba rakakura rekubvisa maganda, isina kutamiswa kweupfu hwemhangura, mashandiro akajeka ekugadzira PCB.
Kushanda (GB/T5230-2000、IPC-4562-2000)
| Kupatsanura | Chikamu | 9μm | 12μm | 18μm | 35μm | 70μm | 105μm | |
| Zvemukati zveCu | % | ≥99.8 | ||||||
| Huremu hweNzvimbo | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | 585±10 | 875±15 | |
| Simba reKusimba | RT(23℃) | Kg/mm2 | ≥28 | |||||
| HT(180℃) | ≥15 | ≥18 | ≥20 | |||||
| Kureba | RT(23℃) | % | ≥5.0 | ≥6.0 | ≥10 | |||
| HT(180℃) | ≥6.0 | ≥8.0 | ||||||
| Kuomarara | Kupenya(Ra) | μm | ≤0.43 | |||||
| Matte(Rz) | ≤3.5 | |||||||
| Simba rekubvisa ganda | RT(23℃) | kg/cm | ≥0.77 | ≥0.8 | ≥0.9 | ≥1.0 | ≥1.5 | ≥2.0 |
| Mwero weHCΦ wakaderera (18%-1hr/25℃) | % | ≤7.0 | ||||||
| Kuchinja kweruvara (E-1.0hr/200℃) | % | Kugona | ||||||
| Solder Inoyangarara 290℃ | Chikamu. | ≥20 | ||||||
| Chitarisiko (Spot uye upfu hwemhangura) | ---- | Hapana | ||||||
| Hole yePin | EA | Zero | ||||||
| Kushivirira Kukura | Upamhi | mm | 0~2mm | |||||
| Kureba | mm | ---- | ||||||
| Core | Mm/inch | Dhayamita yemukati 79mm/3 inch | ||||||
Cherechedza:1. Kukosha kweRz kwepombi yemhangura ndiyo kukosha kwakasimba kwekuyedza, kwete kukosha kwakavimbiswa.
2. Simba rekubvisa mapeel ndiro chiyero chebvunzo yeFR-4 board (mapepa mashanu e7628PP).
3. Nguva yekuvimbisa hunhu hwezvinhu mazuva makumi mapfumbamwe kubva pazuva rekugamuchira.
![[HTE] Foiri yemhangura yeED yakarebesa](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil-300x300.png)
![[BCF] Bhatiri ED Copper Foil](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
![[RTF] Foiri yemhangura yeED Yakagadziriswazve](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil-300x300.png)
